Inventor · disambiguated record
Shigenobu Sekine
Also filed as: SEKINE SHIGENOBU
48 granted patents·11 pending applications·216 citations·filing 1997–2023
97Inventor score
Files withNAPRA CO LTD41SEKINE SHIGENOBU12SANEI KASEI CO LTD3KAWASAKI TEITOKU CO LTD1SAWASAKI TEITOKU CO LTD1
Top patents by PatentIndex Score
59 records- 0198US7803210B2Method for producing spherical particles having nanometer size, crystalline structure, and good sphericityNAPRA CO LTD·Filed 2007·Granted Sep 28, 2010·71 cites·14 claims
- 0297US7842958B1Light-emitting diode, light-emitting device, lighting apparatus, display, and signal lightNAPRA CO LTD·Filed 2010·Granted Nov 30, 2010·36 cites·18 claims
- 0393US10906136B1Joint structureNAPRA CO LTD·Filed 2020·Granted Feb 2, 2021·2 cites·2 claims
- 0490US7547346B2Metal powder with nano-composite structure and its production method using a self assembling techniqueNAPRA CO LTD·Filed 2006·Granted Jun 16, 2009·14 cites·37 claims
- 0588US8217403B1Electronic deviceSEKINE SHIGENOBU·Filed 2011·Granted Jul 10, 2012·10 cites·29 claims
- 0687US10016848B2Metal particles having intermetallic compound nano-composite structure crystalNAPRA CO LTD·Filed 2016·Granted Jul 10, 2018·2 cites·2 claims
- 0784US9735074B1Semiconductor deviceNAPRA CO LTD·Filed 2017·Granted Aug 15, 2017·4 cites·2 claims
- 0882US10507551B2Metal particle and articles formed therefromNAPRA CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·2 claims
- 0982US8766312B2Light-emitting device comprising vertical conductors and through electrodes and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2011·Granted Jul 1, 2014·8 cites·1 claims
- 1082US7910837B2Circuit board, electronic device and method for manufacturing the sameNAPRA CO LTD·Filed 2008·Granted Mar 22, 2011·8 cites·2 claims
- 1180US8415784B2Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing methodSEKINE SHIGENOBU·Filed 2010·Granted Apr 9, 2013·5 cites·23 claims
- 1277US12113321B1TerminalNAPRA CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·6 claims
- 1376US9339871B2Method for producing spherical particles, having nanometer size, crystalline structure, comprising providing a swirling plasma gas flowNAPRA CO LTD·Filed 2014·Granted May 17, 2016·1 cites·14 claims
- 1475US9704793B2Substrate for electronic device and electronic deviceSEKINE SHIGENOBU·Filed 2011·Granted Jul 11, 2017·4 cites·5 claims
- 1575US9076786B2Wiring substrate and manufacturing method thereforNAPRA CO LTD·Filed 2014·Granted Jul 7, 2015·3 cites·7 claims
- 1675US8377565B2Filling material and filling method using the sameNAPRA CO LTD·Filed 2011·Granted Feb 19, 2013·4 cites·4 claims
- 1773US9691519B2Insulating paste, electronic device and method for forming insulatorNAPRA CO LTD·Filed 2013·Granted Jun 27, 2017·1 cites·2 claims
- 1872US11534870B2Metal particleNAPRA CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·4 claims
- 1972US9515044B1Electronic device, method of manufacturing the same, metal particle, and electroconductive pasteNAPRA CO LTD·Filed 2015·Granted Dec 6, 2016·2 cites·3 claims
- 2071US8079131B2Method for filling metal into fine spaceSEKINE SHIGENOBU·Filed 2009·Granted Dec 20, 2011·5 cites·12 claims
- 2171US7781382B2Lubricant composition and bearing structureNAPRA CO LTD·Filed 2006·Granted Aug 24, 2010·1 cites·9 claims
- 2270US11453089B2Bonding structureNAPRA CO LTD·Filed 2019·Granted Sep 27, 2022·0 cites·8 claims
- 2370US8580581B2Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2010·Granted Nov 12, 2013·3 cites·2 claims
- 2469US9730325B2Substrate with built-in passive elementNAPRA CO LTD·Filed 2014·Granted Aug 8, 2017·2 cites·6 claims
- 2569US8759211B2Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing methodNAPRA CO LTD·Filed 2013·Granted Jun 24, 2014·2 cites·2 claims
- 2668US10478924B2Metal particle and electroconductive paste formed therefromNAPRA CO LTD·Filed 2018·Granted Nov 19, 2019·0 cites·1 claims
- 2767US9293416B2Functional materialNAPRA CO LTD·Filed 2014·Granted Mar 22, 2016·2 cites·6 claims
- 2866US9924592B2Three-dimensional laminated circuit board, electronic device, information processing system, and information network systemNAPRA CO LTD·Filed 2016·Granted Mar 20, 2018·1 cites·4 claims
- 2965US9685394B2Electronic device and manufacturing method thereforSEKINE SHIGENOBU·Filed 2011·Granted Jun 20, 2017·2 cites·6 claims
- 3065US2024109156A1Metal particle for joint materialNAPRA CO LTD·Filed 2023·Application pending·0 cites
- 3162US11364575B2Metal particleNAPRA CO LTD·Filed 2021·Granted Jun 21, 2022·0 cites·7 claims
- 3262US7736585B2Metal powder with nano-composite structure and its production method using a self-assembling techniqueNAPRA CO LTD·Filed 2009·Granted Jun 15, 2010·0 cites·19 claims
- 3359US10629506B2Preform for semiconductor encapsulationNAPRA CO LTD·Filed 2017·Granted Apr 21, 2020·0 cites·7 claims
- 3459US9950496B2Multi-layer preform sheetNAPRA CO LTD·Filed 2016·Granted Apr 24, 2018·1 cites·1 claims
- 3558US8758900B2Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the sameSEKINE SHIGENOBU·Filed 2010·Granted Jun 24, 2014·0 cites·6 claims
- 3658US2014023777A1Method for producing wiring board having through hole or non-through holeNAPRA CO LTD·Filed 2013·Application pending·0 cites
- 3756US2021078111A1Metal particleNAPRA CO LTD·Filed 2019·Application pending·0 cites
- 3853US9950925B2Method for forming functional part in minute spaceNAPRA CO LTD·Filed 2017·Granted Apr 24, 2018·0 cites·7 claims
- 3953US9460965B2Semiconductor substrate, eletronic device and method for manufacturing the sameNAPRA CO LTD·Filed 2015·Granted Oct 4, 2016·0 cites·8 claims
- 4052US8569632B2Wiring board having through hole or non-through hole, and method for producing the sameSEKINE SHIGENOBU·Filed 2006·Granted Oct 29, 2013·0 cites·8 claims
- 4152US2011232740A1Solar cellNAPRA CO LTD·Filed 2011·Application pending·0 cites
- 4251US9230860B2Semiconductor substrate, electronic device and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2012·Granted Jan 5, 2016·0 cites·6 claims
- 4350US8609999B2Circuit board, electronic device and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2011·Granted Dec 17, 2013·0 cites·10 claims
- 4449US9349720B2Integrated circuit deviceNAPRA CO LTD·Filed 2014·Granted May 24, 2016·0 cites·4 claims
- 4549US9142518B2Junction and electrical connectionNAPRA CO LTD·Filed 2014·Granted Sep 22, 2015·0 cites·9 claims
- 4649US8217280B2Circuit board, electronic device and method for manufacturing the sameSEKINE SHIGENOBU·Filed 2011·Granted Jul 10, 2012·0 cites·9 claims
- 4749US2013136645A1Method for forming functional part in minute spaceNAPRA CO LTD·Filed 2012·Application pending·0 cites
- 4849US2010031501A1Method for filling through hole or non-through hole formed on board with fillerNAPRA CO LTD·Filed 2008·Application pending·0 cites
- 4948US2013250481A1Conductive fine powder, conductive paste and electronic componentNAPRA CO LTD·Filed 2013·Application pending·0 cites
- 5046US2015228382A1Method for forming conductor in minute spaceNAPRA CO LTD·Filed 2014·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Shigenobu Sekine files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →