Inventor · disambiguated record
Shriya Seshadri
Also filed as: SESHADRI SHRIYA
0 granted patents·4 pending applications·0 citations·filing 2022–2023
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0155US2024329333A1Co-packaging of photonic & electronic integrated circuit dieINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2025112162A1Deep cavity metallization and fiducial arrangements for embedded die and assembly thereof on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 0352US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0451US2024111090A1Directly coupled optical interposerINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →