Inventor · disambiguated record
Shin-Wei Shen
Also filed as: SHEN SHIN-WEI
2 granted patents·2 pending applications·0 citations·filing 2021–2025
30Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0175US12237375B2Semiconductor structure of stacked two-dimensional material layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0273US2025203978A1Method of forming stacked unit layers and stacked two-dimensional material layers, and method of forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0367US11784225B2Semiconductor structure, method of forming stacked unit layers and method of forming stacked two-dimensional material layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 0453US2024203764A1Wafer-level die-transfer tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →