Inventor · disambiguated record
Shusaku Shibata
Also filed as: SHIBATA SHUSAKU
25 granted patents·17 pending applications·5 citations·filing 2011–2025
90Inventor score
Top patents by PatentIndex Score
42 records- 0179US10265693B2Particles, particle dispersion, particle-dispersed resin composition, producing method therefor, resin molded article, producing method therefor, catalyst particles, catalyst solution, catalyst composition, catalyst molded article, titanium complex, titanium oxide particles and producing method thereforNITTO DENKO CORP·Filed 2017·Granted Apr 23, 2019·1 cites·10 claims
- 0273US12120829B2Wiring circuit board assembly sheetNITTO DENKO CORP·Filed 2021·Granted Oct 15, 2024·1 cites·9 claims
- 0369US11647269B2Imaging element-mounting boardNITTO DENKO CORP·Filed 2018·Granted May 9, 2023·1 cites·10 claims
- 0469US11627661B2Wired circuit board and imaging deviceNITTO DENKO CORP·Filed 2021·Granted Apr 11, 2023·0 cites·7 claims
- 0569US2025386427A1Wiring circuit boardNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0667US2025338385A1Wiring circuit boardNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0766US12238859B2Wiring circuit boardNITTO DENKO CORP·Filed 2022·Granted Feb 25, 2025·0 cites·6 claims
- 0866US11266024B2Wired circuit board and production method thereofNITTO DENKO CORP·Filed 2021·Granted Mar 1, 2022·0 cites·3 claims
- 0966US9720134B2Optical laminate comprising hard coat layer comprised of cured product of composition comprising (meth)acrylic prepolymer having hydroxyl groupSHIBATA SHUSAKU·Filed 2012·Granted Aug 1, 2017·2 cites·18 claims
- 1065US12238858B2Wiring circuit boardNITTO DENKO CORP·Filed 2022·Granted Feb 25, 2025·0 cites·7 claims
- 1164US2016222194A1Particles, particle dispersion, particle-dispersed resin composition, producing method therefor, resin molded article, producing method therefor, catalyst particles, catalyst solution, catalyst composition, catalyst molded article, titanium complex, titanium oxide particles and producing method thereforNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1262US2025210425A1Metal core substrate and method of producing the metal core substrateNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 1361US2015065340A1Particles, particle dispersion, particle-dispersed resin composition, producing method therefor, resin molded article, producing method therefor, catalyst particles, catalyst solution, catalyst composition, catalyst molded article, titanium complex, titanium oxide particles and producing method thereforNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1461US2025386430A1Wiring circuit boardNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 1559US2025212328A1Wiring circuit board and method of producing the wiring circuit boardNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 1656US10203430B2Method of producing optical laminate comprising hard coat layer comprised of cured product of composition comprising (meth)acrylic prepolymer having hydroxyl groupNITTO DENKO CORP·Filed 2017·Granted Feb 12, 2019·0 cites·16 claims
- 1755US11032913B2Wired circuit board and production method thereofNITTO DENKO CORP·Filed 2017·Granted Jun 8, 2021·0 cites·4 claims
- 1855US2024292528A1Wiring circuit boardNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 1954US2024206053A1Wiring circuit board and method for producing wiring circuit boardNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 2053US10813221B2Flexible wiring circuit board, producing method thereof, and imaging deviceNITTO DENKO CORP·Filed 2018·Granted Oct 20, 2020·0 cites·10 claims
- 2152US11337302B2Wiring circuit boardNITTO DENKO CORP·Filed 2018·Granted May 17, 2022·0 cites·5 claims
- 2252US2013109770A1Particles, particle dispersion, particle-dispersed resin composition, producing method therefor, resin molded article, producing method therefor, catalyst particles, catalyst solution, catalyst composition, catalyst molded article, titanium complex, titanium oxide particles and producing method thereforHATAKEYAMA YOSHIHARU·Filed 2011·Application pending·0 cites
- 2351US11058002B2Method of producing a wired circuit boardNITTO DENKO CORP·Filed 2018·Granted Jul 6, 2021·0 cites·9 claims
- 2450US11297711B2Wiring circuit board and producing method thereofNITTO DENKO CORP·Filed 2018·Granted Apr 5, 2022·0 cites·10 claims
- 2550US11229116B2Board assembly sheetNITTO DENKO CORP·Filed 2018·Granted Jan 18, 2022·0 cites·6 claims
- 2649US12137522B2Wiring circuit boardNITTO DENKO CORP·Filed 2020·Granted Nov 5, 2024·0 cites·11 claims
- 2746US11122676B2Flexible wiring circuit board and imaging deviceNITTO DENKO CORP·Filed 2018·Granted Sep 14, 2021·0 cites·10 claims
- 2846US2024015884A1Wiring circuit board and method for producing wiring circuit boardNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2945US12507341B2Wiring circuit board and producing method thereofNITTO DENKO CORP·Filed 2020·Granted Dec 23, 2025·0 cites·10 claims
- 3043US2024023237A1Wiring circuit boardNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 3142US12284757B2Wiring circuit boardNITTO DENKO CORP·Filed 2021·Granted Apr 22, 2025·0 cites·5 claims
- 3242US10537909B2Powder coating apparatusNITTO DENKO CORP·Filed 2015·Granted Jan 21, 2020·0 cites·4 claims
- 3341US12114438B2Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit boardNITTO DENKO CORP·Filed 2020·Granted Oct 8, 2024·0 cites·6 claims
- 3441US11183448B2Wiring circuit board and imaging deviceNITTO DENKO CORP·Filed 2018·Granted Nov 23, 2021·0 cites·8 claims
- 3540US11081437B2Imaging element mounting board, producing method of imaging element mounting board, and mounting board assemblyNITTO DENKO CORP·Filed 2018·Granted Aug 3, 2021·0 cites·14 claims
- 3639US10139525B2Optical laminate having hard coat layer composition with specified quantities of monofunctional monomer and varied (meth)acryloyl group containing compoundsSHIBATA SHUSAKU·Filed 2012·Granted Nov 27, 2018·0 cites·14 claims
- 3739US2013242395A1Methods of producing light diffusing element and polarizing plate with light diffusing element, and light diffusing element and polarizing plate with light diffusing element obtained by the methodsNISHIMURA AKINORI·Filed 2011·Application pending·0 cites
- 3838US2014044891A1Optical laminateSHIBATA SHUSAKU·Filed 2012·Application pending·0 cites
- 3937US9847544B2Ion conductive organic-inorganic composite particles, particle-containing resin composition and ion conductive molded articleHATAKEYAMA YOSHIHARU·Filed 2011·Granted Dec 19, 2017·0 cites·7 claims
- 4036US2022408556A1Wiring circuit boardNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 4135US2011247523A1Organic-inorganic composite particles, particle dispersion, particle-dispersed resin composition, and method for producing organic-inorganic composite particlesUNIV TOHOKU·Filed 2011·Application pending·0 cites
- 4235US2017256767A1Lithium metal secondary batteryNITTO DENKO CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →