Inventor · disambiguated record
Shing-Yih Shih
Also filed as: SHIH SHING-YIH
164 granted patents·55 pending applications·813 citations·filing 2002–2025
99Inventor score
Files withNANYA TECHNOLOGY CORP164MICRON TECHNOLOGY INC37INOTERA MEMORIES INC12SHIH SHING-YIH4LIAO CHIEN-MAO1
Top patents by PatentIndex Score
219 records- 0199US9922845B1Semiconductor package and fabrication method thereofMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 20, 2018·44 cites·18 claims
- 0299US9786586B1Semiconductor package and fabrication method thereofMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 10, 2017·58 cites·20 claims
- 0399US9607967B1Multi-chip semiconductor package with via components and method for manufacturing the sameINOTERA MEMORIES INC·Filed 2015·Granted Mar 28, 2017·137 cites·19 claims
- 0498US11315869B1Semiconductor device with decoupling unit and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·6 cites·20 claims
- 0598US11127632B1Semiconductor device with conductive protrusions and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 21, 2021·6 cites·18 claims
- 0698US11063012B1Semiconductor structure having buffer under bump pad and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2020·Granted Jul 13, 2021·5 cites·20 claims
- 0798US10833052B2Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 10, 2020·38 cites·16 claims
- 0898US9761559B1Semiconductor package and fabrication method thereofMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·39 cites·17 claims
- 0998US9449953B1Package-on-package assembly and method for manufacturing the sameINOTERA MEMORIES INC·Filed 2015·Granted Sep 20, 2016·46 cites·9 claims
- 1097US12354965B2Semiconductor device with redistribution structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Jul 8, 2025·3 cites·20 claims
- 1197US12100634B2Semiconductor device with re-fill layerNANYA TECHNOLOGY CORP·Filed 2021·Granted Sep 24, 2024·4 cites·17 claims
- 1297US11710693B2Wafer level package utilizing molded interposerMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 25, 2023·3 cites·19 claims
- 1397US11355464B2Semiconductor device structure with bottle-shaped through silicon via and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jun 7, 2022·4 cites·20 claims
- 1497US11315904B2Semiconductor assembly and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·4 cites·20 claims
- 1597US11127628B1Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 21, 2021·4 cites·18 claims
- 1697US11094662B1Semiconductor assembly and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 17, 2021·5 cites·7 claims
- 1797US10937749B2Methods of forming microelectronic devices including dummy diceMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 2, 2021·12 cites·19 claims
- 1897US10872852B2Wafer level package utilizing molded interposerMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 22, 2020·20 cites·12 claims
- 1997US10043769B2Semiconductor devices including dummy chipsMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 7, 2018·17 cites·20 claims
- 2097US9570369B1Semiconductor package with sidewall-protected RDL interposer and fabrication method thereofINOTERA MEMORIES INC·Filed 2016·Granted Feb 14, 2017·17 cites·5 claims
- 2197US9437583B1Package-on-package assembly and method for manufacturing the sameINOTERA MEMORIES INC·Filed 2016·Granted Sep 6, 2016·18 cites·4 claims
- 2296US9922924B1Interposer and semiconductor packageMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 20, 2018·15 cites·20 claims
- 2396US9721923B1Semiconductor package with multiple coplanar interposersMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 1, 2017·13 cites·11 claims
- 2496US9704790B1Method of fabricating a wafer level packageMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 11, 2017·13 cites·9 claims
- 2596US9520333B1Wafer level package and fabrication method thereofINOTERA MEMORIES INC·Filed 2015·Granted Dec 13, 2016·28 cites·13 claims
- 2695US12278190B2Manufacturing method of semiconductor package structure having interconnections between diesNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 15, 2025·2 cites·12 claims
- 2795US12272651B2Semiconductor package structure having interconnections between dies and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2022·Granted Apr 8, 2025·2 cites·18 claims
- 2895US11728316B2Method for fabricating semiconductor device with heat dissipation featuresNANYA TECHNOLOGY CORP·Filed 2022·Granted Aug 15, 2023·2 cites·19 claims
- 2995US11302608B2Semiconductor device with protection layers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 12, 2022·3 cites·11 claims
- 3095US10181401B1Method for manufacturing a semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2018·Granted Jan 15, 2019·12 cites·11 claims
- 3194US11646292B2Method for fabricating semiconductor device with re-fill layerNANYA TECHNOLOGY CORP·Filed 2021·Granted May 9, 2023·2 cites·7 claims
- 3294US9449935B1Wafer level package and fabrication method thereofINOTERA MEMORIES INC·Filed 2015·Granted Sep 20, 2016·11 cites·9 claims
- 3393US9761540B2Wafer level package and fabrication method thereofMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 12, 2017·10 cites·11 claims
- 3492US11587901B2Semiconductor device with redistribution structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 21, 2023·2 cites·8 claims
- 3592US11574891B2Semiconductor device with heat dissipation unit and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 7, 2023·2 cites·16 claims
- 3692US10395976B1Method of manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2018·Granted Aug 27, 2019·9 cites·14 claims
- 3791US12456703B2Semiconductor device structure including a bonding structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 28, 2025·1 cites·20 claims
- 3891US11462453B2Semiconductor device with protection layers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Oct 4, 2022·2 cites·13 claims
- 3991US10566229B2Microelectronic package structures including redistribution layersMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 18, 2020·6 cites·15 claims
- 4091US10147608B1Method for preparing a patterned target layerNANYA TECHNOLOGY CORP·Filed 2017·Granted Dec 4, 2018·8 cites·13 claims
- 4191US9576931B1Method for fabricating wafer level packageINOTERA MEMORIES INC·Filed 2016·Granted Feb 21, 2017·8 cites·6 claims
- 4290US10553433B2Method for preparing a semiconductor structureNANYA TECHNOLOGY CORP·Filed 2018·Granted Feb 4, 2020·4 cites·12 claims
- 4390US10121849B2Methods of fabricating a semiconductor structureMICRON TECHNOLOGY INC·Filed 2015·Granted Nov 6, 2018·6 cites·15 claims
- 4490US10008461B2Semiconductor structure having a patterned surface structure and semiconductor chips including such structuresMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 26, 2018·5 cites·14 claims
- 4589US11043469B1Method of forming three dimensional semiconductor structureNANYA TECHNOLOGY CORP·Filed 2020·Granted Jun 22, 2021·2 cites·12 claims
- 4689US10381301B2Semiconductor package and method for fabricating the sameMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 13, 2019·5 cites·20 claims
- 4789US10128212B2Semiconductor package and fabrication method thereofMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·5 cites·18 claims
- 4889US9613895B1Semiconductor package with double side moldingINOTERA MEMORIES INC·Filed 2016·Granted Apr 4, 2017·6 cites·8 claims
- 4988US10529570B1Method for preparing a semiconductor structureNANYA TECHNOLOGY CORP·Filed 2018·Granted Jan 7, 2020·5 cites·20 claims
- 5087US11610833B2Conductive feature with non-uniform critical dimension and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Mar 21, 2023·2 cites·3 claims
Showing the top 50 of 219 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →