Inventor · disambiguated record
Shinji Shimaoka
Also filed as: SHIMAOKA SHINJI
2 granted patents·9 pending applications·56 citations·filing 1986–2024
64Inventor score
Top patents by PatentIndex Score
11 records- 0185US4667541AFail-safe gear-shifting control system for an automatic transmissionMAZDA MOTOR·Filed 1986·Granted May 26, 1987·42 cites·11 claims
- 0272US2025277111A1Resin composition, prepreg, laminated plate, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0368US2025326893A1Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0457US2024247120A1Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0554US2025287499A1Prepreg, laminated plate, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0654US2025112115A1Semiconductor package and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0750US2024088051A1Method for producing semiconductor device, wiring board, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0848US2023356498A1Organic core material, production method for same, laminate including organic core material, and circuit boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0948US2024381529A1Method for manufacturing substrate material for semiconductor package, prepreg, and application for prepregRESONAC CORP·Filed 2021·Application pending·0 cites
- 1048US2023331946A1Method for manufacturing substrate material for semiconductor package, prepreg, and substrate material for semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 1146US5230256AAutomatic transmission control system with dual throttlesMAZDA MOTOR·Filed 1992·Granted Jul 27, 1993·14 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →