Inventor · disambiguated record
Shaulin Shue
Also filed as: SHUE SHAULIN
8 granted patents·2 pending applications·233 citations·filing 1997–2005
89Inventor score
Top patents by PatentIndex Score
10 records- 0183US5970378AMulti-step plasma treatment process for forming low resistance titanium nitride layerTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Oct 19, 1999·71 cites·15 claims
- 0283US5702972AMethod of fabricating MOSFET devicesTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Dec 30, 1997·59 cites·20 claims
- 0371US6875692B1Copper electromigration inhibition by copper alloy formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·18 cites·44 claims
- 0469US7182849B2ECP polymer additives and method for reducing overburden and defectsTAIWAN SEMICONDUCOTR MFG CO LT·Filed 2004·Granted Feb 27, 2007·8 cites·16 claims
- 0560US5688718AMethod of CVD TiN barrier layer integrationTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Nov 18, 1997·26 cites·23 claims
- 0658US6309964B1Method for forming a copper damascene structure over tungsten plugs with improved adhesion, oxidation resistance, and diffusion barrier properties using nitridation of the tungsten plugTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 30, 2001·24 cites·18 claims
- 0757US6077779AMulti-step deposition to improve the conformality of ionized PVD filmsTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jun 20, 2000·21 cites·12 claims
- 0854US6849173B1Technique to enhance the yield of copper interconnectionsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Feb 1, 2005·6 cites·62 claims
- 0947US2005199507A1Chemical structures and compositions of ECP additives to reduce pit defectsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1040US2006189131A1Composition and process for element displacement metal passivationTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →