Inventor · disambiguated record
Shinnosuke Soda
Also filed as: SODA SHINNOSUKE
13 granted patents·5 pending applications·31 citations·filing 2005–2023
87Inventor score
Top patents by PatentIndex Score
18 records- 0184US7894205B2Variable device circuit and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Feb 22, 2011·12 cites·20 claims
- 0278US10170433B2Insulated circuit board, power module and power unitMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jan 1, 2019·4 cites·20 claims
- 0375US10418295B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 17, 2019·3 cites·14 claims
- 0473US10741478B2Power module and method of manufacturing the same, and power electronic apparatus and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 11, 2020·2 cites·18 claims
- 0573US10707146B2Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivityMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 7, 2020·2 cites·12 claims
- 0668US10510640B2Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 17, 2019·2 cites·14 claims
- 0767US8816493B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Aug 26, 2014·2 cites·8 claims
- 0866US10566316B2Semiconductor device and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 18, 2020·1 cites·5 claims
- 0959US7675383B2Switch circuitMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Mar 9, 2010·3 cites·5 claims
- 1057US2024030087A1Semiconductor device, method of manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1150US12094798B2Power semiconductor device including a deformable flow blocking member between a module unit and a cooling unitMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Sep 17, 2024·0 cites·18 claims
- 1246US9666519B2Power semiconductor module and power unitMITSUBISHI ELECTRIC CORP·Filed 2014·Granted May 30, 2017·0 cites·13 claims
- 1346US9508564B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Nov 29, 2016·0 cites·9 claims
- 1446US2009250160A1Method of fabricating optical functional elementMITSUBISHI ELECTRIC CORP·Filed 2009·Application pending·0 cites
- 1543US10727186B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·0 cites·14 claims
- 1642US2014175615A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2013·Application pending·0 cites
- 1741US2022181221A1Semiconductor module and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 1834US2009027138A1Switch CircuitNISHINO TAMOTSU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →