Inventor · disambiguated record
Shihui Song
Also filed as: SONG SHIHUI
4 granted patents·5 pending applications·1 citations·filing 2012–2024
57Inventor score
Top patents by PatentIndex Score
9 records- 0162US2020216324A1Complex of lamellar inorganic compound and organic compound and method of producing thereof, delaminated lamellar inorganic compound and method of producing thereof, insulating resin composition, resin sheet, insulator, resin sheet cured product, and heat dissipating memberHITACHI CHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 0260US2024211356A1Restoration of a computing sessionGOOGLE LLC·Filed 2024·Application pending·0 cites
- 0353US2018044191A1Complex of lamellar inorganic compound and organic compound and method of producing thereof, delaminated lamellar inorganic compound and method of producing thereof, insulating resin composition, resin sheet, insulator, resin sheet cured product, and heat dissipating memberHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0452US11921592B2Restoration of a computing sessionGOOGLE LLC·Filed 2020·Granted Mar 5, 2024·0 cites·18 claims
- 0552US9711564B2Preparation method for high-voltage LED device integrated with pattern arrayDURA CHIP (SUZHOU) LTD·Filed 2012·Granted Jul 18, 2017·1 cites·20 claims
- 0651US10373727B2Prepreg mica tape and coil using sameHITACHI CHEMICAL CO LTD·Filed 2014·Granted Aug 6, 2019·0 cites·15 claims
- 0741US9859331B2Preparation method for high-voltage LED device integrated with pattern arrayDURA CHIP (SUZHOU) LTD·Filed 2017·Granted Jan 2, 2018·0 cites·8 claims
- 0838US2018148622A1Resin composition, resin sheet, prepreg, insulator, resin sheet cured product, and heat dissipatorHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0935US2014248504A1Resin composition, resin sheet, cured resin sheet, resin-adhered metal foil and heat dissipation deviceSONG SHIHUI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →