Inventor · disambiguated record
Shingo Sudo
Also filed as: SUDO SHINGO
8 granted patents·7 pending applications·53 citations·filing 2006–2023
81Inventor score
Top patents by PatentIndex Score
15 records- 0188US7589412B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Sep 15, 2009·27 cites·6 claims
- 0285US7671382B2Semiconductor device with thermoplastic resin to reduce warpageMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Mar 2, 2010·17 cites·9 claims
- 0377US7768118B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Aug 3, 2010·8 cites·4 claims
- 0475US11963576B2Sole structure for a shoe, shoe having same, and method for manufacturing sameMIZUNO KK·Filed 2021·Granted Apr 23, 2024·1 cites·7 claims
- 0556US12290150B2Stud for outsole, outsole for cleated shoe, method for producing outsole, and cleated shoeMIZUNO KK·Filed 2023·Granted May 6, 2025·0 cites·9 claims
- 0650US2020093223A1Sole Structure and Shoe with the Sole StructureMIZUNO KK·Filed 2019·Application pending·0 cites
- 0750US2020093218A1Sole StructureMIZUNO KK·Filed 2019·Application pending·0 cites
- 0850US2020093219A1Sole Structure and Shoe with the Sole StructureMIZUNO KK·Filed 2019·Application pending·0 cites
- 0948US2021146644A1Method for Manufacturing a Sole of an Article of FootwearMIZUNO KK·Filed 2020·Application pending·0 cites
- 1048US2021251339A1ShoesMIZUNO KK·Filed 2019·Application pending·0 cites
- 1146US11758977B2Sole and baseball spike shoe with the soleMIZUNO KK·Filed 2021·Granted Sep 19, 2023·0 cites·4 claims
- 1246US2020307134A1Method for producing sole structure memberMIZUNO KK·Filed 2020·Application pending·0 cites
- 1344US2021137211A1Sole Structure for a Shoe and Method for Manufacturing the SameMIZUNO KK·Filed 2020·Application pending·0 cites
- 1439US11217514B2Power semiconductor device, method for manufacturing power semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 1534US11631653B2Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 18, 2023·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →