Inventor · disambiguated record
Shinzo Sugai
Also filed as: SUGAI SHINZO
12 granted patents·108 citations·filing 1978–1996
91Inventor score
Top patents by PatentIndex Score
12 records- 0174US4207381ABimetal and method for manufacturing the sameTOKYO SHIBAURA ELECTRIC CO·Filed 1978·Granted Jun 10, 1980·13 cites·7 claims
- 0261US4640723ALead frame and method for manufacturing the sameTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Feb 3, 1987·22 cites·3 claims
- 0357US5098652APrecision parts of non-magnetic stainless steelsTOSHIBA KK·Filed 1990·Granted Mar 24, 1992·13 cites·9 claims
- 0456US4864188ANi-Fe base alloy sheet for use as a shadow mask and a shadow mask employing the sameTOSHIBA KK·Filed 1987·Granted Sep 5, 1989·8 cites·6 claims
- 0548US4771213AShadow maskTOSHIBA KK·Filed 1986·Granted Sep 13, 1988·12 cites·7 claims
- 0643US5578898AShadow mask and cathode ray tubeTOSHIBA KK·Filed 1996·Granted Nov 26, 1996·6 cites·24 claims
- 0743US4290828AMethod for manufacturing bimetalTOKYO SHIBAURA ELECTRIC CO·Filed 1979·Granted Sep 22, 1981·6 cites·19 claims
- 0841US5264050AFe-Ni based alloyTOSHIBA KK·Filed 1991·Granted Nov 23, 1993·12 cites·6 claims
- 0939US4835548AThermal headTOSHIBA KK·Filed 1987·Granted May 30, 1989·5 cites·7 claims
- 1037US5210441ALead frame formed of a copper-zirconium alloyTOSHIBA KK·Filed 1991·Granted May 11, 1993·7 cites·14 claims
- 1132US5294761AVacuum interrupterTOSHIBA KK·Filed 1991·Granted Mar 15, 1994·3 cites·4 claims
- 1229US5341025AIC package and LSI package using a lead frame formed of a copper-zirconium alloyTOSHIBA KK·Filed 1993·Granted Aug 23, 1994·1 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →