Inventor · disambiguated record
Shigeru Sugino
Also filed as: SUGINO SHIGERU
13 granted patents·2 pending applications·65 citations·filing 1994–2019
87Inventor score
Top patents by PatentIndex Score
15 records- 0183US9709619B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2013·Granted Jul 18, 2017·5 cites·4 claims
- 0277US10863629B2Method of manufacturing through hole of substrateFUJITSU LTD·Filed 2019·Granted Dec 8, 2020·2 cites·5 claims
- 0377US5535496AMachine tool with partsSUGINO CORP·Filed 1994·Granted Jul 16, 1996·42 cites·27 claims
- 0465US9295155B2Flexible printed boardNAKAMURA NAOKI·Filed 2012·Granted Mar 22, 2016·1 cites·2 claims
- 0564US8269114B2Flexible printed boardNAKAMURA NAOKI·Filed 2010·Granted Sep 18, 2012·1 cites·3 claims
- 0662US7187956B2Portable communication apparatus and microphone device for the apparatusHOSIDEN CORP·Filed 2002·Granted Mar 6, 2007·7 cites·1 claims
- 0755US10605851B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2017·Granted Mar 31, 2020·0 cites·1 claims
- 0854US10624216B2Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring boardFUJITSU LTD·Filed 2018·Granted Apr 14, 2020·0 cites·13 claims
- 0948US8305767B2Printed wiring board reliably achieving electric connection with electronic componentNAKAMURA NAOKI·Filed 2007·Granted Nov 6, 2012·0 cites·6 claims
- 1047US10342129B2Substrate and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Jul 2, 2019·0 cites·4 claims
- 1145US10393797B2Inspection method of laminated board, inspection module, and palletFUJITSU LTD·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 1245US8035978B2Printed circuit board, fabrication method and apparatusFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·0 cites·3 claims
- 1342US2011132654A1Multilayer printed circuit board, method for manufacturing the same, and electronic apparatusFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1436US2011286188A1Multilayer printed circuit board using flexible interconnect structure, and method of making sameKANAI RYO·Filed 2011·Application pending·0 cites
- 1535US5704738ATool attachment assemblyFiled 1996·Granted Jan 6, 1998·7 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →