Inventor · disambiguated record
Shinichirou Sukata
Also filed as: SUKATA SHINICHIROU
8 granted patents·9 pending applications·1 citations·filing 2010–2025
72Inventor score
Files withRESONAC CORP7SHOWA DENKO MATERIALS CO LTD5HAYASHI HIROKI2HITACHI CHEMICAL CO LTD1MOMOZAKI AYA1
Top patents by PatentIndex Score
17 records- 0176US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 0272US9862866B2Electrically conductive adhesive composition, connection structure, solar battery module, and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jan 9, 2018·1 cites·17 claims
- 0370US2025293091A1Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationRESONAC CORP·Filed 2025·Application pending·0 cites
- 0469US2025083262A1Solder particles and method for producing solder particlesRESONAC CORP·Filed 2024·Application pending·0 cites
- 0565US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 0658US12070800B2Electronic component and method for manufacturing electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·6 claims
- 0756US12247270B2Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recessesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·12 claims
- 0856US2025387833A1Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal pasteRESONAC CORP·Filed 2024·Application pending·0 cites
- 0953US12354914B2Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 8, 2025·0 cites·13 claims
- 1052US12297377B2Conductive adhesive composition, and method for producing connection structureRESONAC CORP·Filed 2021·Granted May 13, 2025·0 cites·10 claims
- 1150US2021229222A1Solder particles and method for producing solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1249US2014144481A1Solar cell moduleHAYASHI HIROKI·Filed 2011·Application pending·0 cites
- 1348US8962986B2Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell moduleHAYASHI HIROKI·Filed 2010·Granted Feb 24, 2015·0 cites·12 claims
- 1443US2024105653A1Solder paste, method for forming solder bumps, and method for producing member with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 1543US2024297135A1Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 1638US2013340806A1Electrically conductive adhesive composition, connector and solar cell moduleSUKATA SHINICHIROU·Filed 2012·Application pending·0 cites
- 1728US9837572B2Solar cell module and method of manufacturing thereofMOMOZAKI AYA·Filed 2012·Granted Dec 5, 2017·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →