Inventor · disambiguated record
Shyam Surthi
Also filed as: SURTHI SHYAM
69 granted patents·20 pending applications·241 citations·filing 2003–2025
98Inventor score
Files withMICRON TECHNOLOGY INC60SURTHI SHYAM9LODESTAR LICENSING GROUP LLC6NANYA TECHNOLOGY CORP3GUHA JAYDIP2
Top patents by PatentIndex Score
89 records- 0197US7557013B2Methods of forming a plurality of capacitorsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 7, 2009·70 cites·45 claims
- 0296US11037956B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 15, 2021·4 cites·24 claims
- 0395US10777576B1Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 15, 2020·12 cites·48 claims
- 0494US9559201B2Vertical memory devices, memory arrays, and memory devicesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 31, 2017·10 cites·24 claims
- 0593US8569831B2Integrated circuit arrays and semiconductor constructionsHEINECK LARS P·Filed 2011·Granted Oct 29, 2013·16 cites·10 claims
- 0691US8529996B2High-temperature attachment of organic molecules to substratesBOCIAN DAVID F·Filed 2007·Granted Sep 10, 2013·16 cites·35 claims
- 0790US11672120B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·2 cites·19 claims
- 0888US11672118B2Electronic devices comprising adjoining oxide materials and related systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 6, 2023·2 cites·17 claims
- 0988US11081497B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·4 cites·30 claims
- 1087US8450175B2Methods of forming a vertical transistor and at least a conductive line electrically coupled therewithGUHA JAYDIP·Filed 2011·Granted May 28, 2013·8 cites·11 claims
- 1186US9691773B2Silicon buried digit line access device and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2013·Granted Jun 27, 2017·8 cites·7 claims
- 1286US2025089255A1Integrated assemblies and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 1385US11107830B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 31, 2021·3 cites·30 claims
- 1485US7223628B2High temperature attachment of organic molecules to substratesUNIV CALIFORNIA·Filed 2003·Granted May 29, 2007·24 cites·39 claims
- 1585US2025098168A1Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 1684US8609488B2Methods of forming a vertical transistor and at least a conductive line electrically coupled therewithMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 17, 2013·5 cites·23 claims
- 1784US7928019B2Semiconductor processingMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 19, 2011·8 cites·9 claims
- 1883US12150303B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Nov 19, 2024·0 cites·18 claims
- 1983US11171153B2Integrated assemblies having improved charge migrationMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·2 cites·18 claims
- 2082US9041099B2Single-sided access device and fabrication method thereofSURTHI SHYAM·Filed 2011·Granted May 26, 2015·7 cites·20 claims
- 2180US8129289B2Method to deposit conformal low temperature SiO2SMYTHE JOHN A·Filed 2006·Granted Mar 6, 2012·10 cites·22 claims
- 2279US12185544B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Dec 31, 2024·0 cites·16 claims
- 2379US10923480B2Capacitance reduction in a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 16, 2021·2 cites·29 claims
- 2479US8946018B2Methods of forming memory arrays and semiconductor constructionsGUHA JAYDIP·Filed 2012·Granted Feb 3, 2015·4 cites·6 claims
- 2578US11244954B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 8, 2022·2 cites·30 claims
- 2678US9230968B2Methods of forming memory arrays and semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2014·Granted Jan 5, 2016·3 cites·24 claims
- 2775US2024363540A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2874US11417682B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 16, 2022·0 cites·11 claims
- 2974US11031414B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 8, 2021·1 cites·31 claims
- 3073US9111853B2Methods of forming doped elements of semiconductor device structuresMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 18, 2015·2 cites·17 claims
- 3173US7858535B2Methods of reducing defect formation on silicon dioxide formed by atomic layer deposition (ALD) processes and methods of fabricating semiconductor structuresMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·3 cites·17 claims
- 3273US2025372302A1Capacitors for a microelectronic device having increased density and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3372US8790977B2Methods of forming a vertical transistor, methods of forming memory cells, and methods of forming arrays of memory cellsMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 29, 2014·2 cites·18 claims
- 3470US2024381646A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3569US12156406B2Methods of forming integrated assemblies with improved charge migration impedanceLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 3668US12237013B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 25, 2025·0 cites·37 claims
- 3768US12057400B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 6, 2024·0 cites·29 claims
- 3867US11729982B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 15, 2023·0 cites·16 claims
- 3967US9070584B2Buried digitline (BDL) access device and memory arrayNANYA TECHNOLOGY CORP·Filed 2013·Granted Jun 30, 2015·2 cites·11 claims
- 4067US8007275B2Methods and apparatuses for heating semiconductor wafersMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 30, 2011·2 cites·23 claims
- 4166US11563031B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 24, 2023·0 cites·19 claims
- 4266US11024644B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·0 cites·22 claims
- 4365US12041779B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 16, 2024·0 cites·18 claims
- 4465US9318493B2Memory arrays, semiconductor constructions, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 19, 2016·1 cites·10 claims
- 4565US2025157537A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4664US11871572B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Jan 9, 2024·0 cites·23 claims
- 4764US9478550B2Arrays of vertically-oriented transistors, and memory arrays including vertically-oriented transistorsKARDA KAMAL M·Filed 2012·Granted Oct 25, 2016·2 cites·25 claims
- 4864US8871589B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 28, 2014·1 cites·14 claims
- 4964US7989360B2Semiconductor processing methods, and methods for forming silicon dioxideMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 2, 2011·1 cites·13 claims
- 5063US11631697B2Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 18, 2023·0 cites·18 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →