Inventor · disambiguated record
Shih-Yi Syu
Also filed as: SYU SHIH-YI
10 granted patents·3 pending applications·21 citations·filing 2011–2024
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0190US10290559B2Thermal dissipation through seal rings in 3DIC structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 14, 2019·5 cites·20 claims
- 0288US11037854B2Thermal dissipation through seal rings in 3DIC structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 15, 2021·2 cites·20 claims
- 0383US10535580B2Thermal dissipation through seal rings in 3DIC structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·2 cites·20 claims
- 0482US9490190B2Thermal dissipation through seal rings in 3DIC structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Nov 8, 2016·4 cites·19 claims
- 0578US10515887B2Fan-out package structure having stacked carrier substrates and method for forming the sameMEDIATEK INC·Filed 2017·Granted Dec 24, 2019·3 cites·23 claims
- 0674US11848247B2Thermal dissipation through seal rings in 3DIC structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 0774US9704808B2Semiconductor device and wafer level package including such semiconductor deviceMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·2 cites·26 claims
- 0868US10224287B2Semiconductor device and wafer level package including such semiconductor deviceMEDIATEK INC·Filed 2017·Granted Mar 5, 2019·1 cites·17 claims
- 0967US8816495B2Structures and formation methods of packages with heat sinksWANG CHUNG YU·Filed 2012·Granted Aug 26, 2014·2 cites·16 claims
- 1055US2025038126A1Semiconductor package having electromagnetic interference shielding structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1154US2023253389A1Semiconductor package assemblyMEDIATEK INC·Filed 2022·Application pending·0 cites
- 1252US2024312893A1Electronic deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1343US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →