Inventor · disambiguated record
Shih-Peng Tai
Also filed as: TAI SHIH-PENG
23 granted patents·25 pending applications·1,849 citations·filing 2003–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD42AU OPTRONICS CORP3NOVATEK MICROELECTRONICS CORP1TAIWAN SEMICONDUCTOR MFG1YU CHEN-HUA1
Top patents by PatentIndex Score
48 records- 0198US9281254B2Methods of forming integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·1.8k cites·20 claims
- 0292US9812381B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·7 cites·20 claims
- 0389US10163807B2Alignment pattern for package singulationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·6 cites·20 claims
- 0487US9653427B2Integrated circuit package with probe pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·5 cites·20 claims
- 0586US9524942B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 20, 2016·6 cites·20 claims
- 0684US2025300115A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0782US2024379606A1Method for manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0881US11682647B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·1 cites·20 claims
- 0981US6992329B2Multi-domain vertical alignment liquid crystal displayAU OPTRONICS CORP·Filed 2003·Granted Jan 31, 2006·20 cites·8 claims
- 1080US12347801B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 1180US2025357235A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1279US2025355174A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1378US11955401B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1474US11626341B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 11, 2023·0 cites·20 claims
- 1574US2025329616A1Semiconductor structure having through substrate via and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1673US12272613B2Thermal structure for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 1773US12176299B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1869US2025201649A1Thermal Structure for Semiconductor Device and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1968US2024103218A1Optical Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2067US12374602B2Semiconductor structure having through substrate via and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 2166US11289398B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 2265US6977706B2In-plane switching mode liquid crystal display having heightened electrodesAU OPTRONICS CORP·Filed 2003·Granted Dec 20, 2005·10 cites·14 claims
- 2365US2023402340A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2462US10679951B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 2561US11587887B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 2661US2024319590A1Optical Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2759US10163822B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 2859US2025118612A1Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2958US2024114702A1Semiconductor device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3057US2025004202A1Photonic package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3156US12374596B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 3256US9922943B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·0 cites·19 claims
- 3356US2024153901A1Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resulting StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3456US2024113034A1Methods for forming semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3556US2024096722A1Fan-Out Stacked Package and Methods of Making the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3655US9984969B2Semiconductor devices, multi-die packages, and methods of manufacure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·0 cites·20 claims
- 3754US2024047216A1Trimming Through Etching in Wafer to Wafer BondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3853US2024404909A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3953US2023361048A1Semiconductor package and method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4053US2025052966A1Photonic package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4152US2023352418A1Semiconductor die, semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4252US2025054871A1Systems for visible wavelength measurement of overlay of wafer-on-wafer bonding and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4352US2024118491A1Photonic semiconductor device, photonic semiconductor package using the same and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4451US9659863B2Semiconductor devices, multi-die packages, and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·0 cites·20 claims
- 4547US2006054890A1Multi-domain vertical alignment liquid crystal displayAU OPTRONICS CORP·Filed 2005·Application pending·0 cites
- 4642US11158600B2Lithography process for semiconductor packaging and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 4741US2013241057A1Methods and Apparatus for Direct Connections to Through ViasYU CHEN-HUA·Filed 2012·Application pending·0 cites
- 4835US2011205873A1Long seek control system and method thereof used in optical information reproduction/recording systemNOVATEK MICROELECTRONICS CORP·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →