Inventor · disambiguated record
Shinichi Takagi
Also filed as: MIURA MINORU · TAKAGI SHINICHI
71 granted patents·8 pending applications·2,827 citations·filing 1977–2018
99Inventor score
Files withTOSHIBA KK26MITSUBISHI ELECTRIC CORP22MITSUBOSHI BELTING LTD8SUMITOMO CHEMICAL CO6NIKON CORP4
Top patents by PatentIndex Score
79 records- 0199US6607948B1Method of manufacturing a substrate using an SiGe layerTOSHIBA KK·Filed 2001·Granted Aug 19, 2003·663 cites·12 claims
- 0299US6339232B1Semiconductor deviceTOSHIBA KK·Filed 2000·Granted Jan 15, 2002·349 cites·21 claims
- 0397US7235456B2Method of making empty space in siliconTOSHIBA KK·Filed 2006·Granted Jun 26, 2007·38 cites·26 claims
- 0497US6774390B2Semiconductor deviceTOSHIBA KK·Filed 2003·Granted Aug 10, 2004·137 cites·20 claims
- 0597US6583437B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Jun 24, 2003·131 cites·7 claims
- 0697US6326667B1Semiconductor devices and methods for producing semiconductor devicesTOSHIBA KK·Filed 2000·Granted Dec 4, 2001·143 cites·21 claims
- 0796US7622773B2Semiconductor device including multi-gate metal-insulator-semiconductor (MIS) transistorTOSHIBA KK·Filed 2007·Granted Nov 24, 2009·40 cites·17 claims
- 0896US7507634B2Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatmentTOSHIBA KK·Filed 2007·Granted Mar 24, 2009·28 cites·7 claims
- 0996US6690043B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Feb 10, 2004·130 cites·3 claims
- 1095US7019364B1Semiconductor substrate having pillars within a closed empty spaceTOSHIBA KK·Filed 2000·Granted Mar 28, 2006·74 cites·12 claims
- 1194US5216271ABiCMOS device with low bandgap CMOS contact regions and low bandgap bipolar base regionTOSHIBA KK·Filed 1991·Granted Jun 1, 1993·133 cites·10 claims
- 1293US6709909B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Mar 23, 2004·63 cites·9 claims
- 1393US6509587B2Semiconductor deviceTOSHIBA KK·Filed 2001·Granted Jan 21, 2003·76 cites·10 claims
- 1493US5032891ASemiconductor memory device and manufacturing method thereofTOSHIBA KK·Filed 1990·Granted Jul 16, 1991·110 cites·11 claims
- 1592US8008751B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Aug 30, 2011·22 cites·7 claims
- 1692US7217958B2Feed through structure for optical semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2006·Granted May 15, 2007·14 cites·10 claims
- 1790US7619239B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2006·Granted Nov 17, 2009·20 cites·4 claims
- 1890US5469260AStage-position measuring apparatusNIKON CORP·Filed 1994·Granted Nov 21, 1995·67 cites·7 claims
- 1989US4708699AMethod and apparatus for reducing sound emanation from a drive systemMITSUBOSHI BELTING LTD·Filed 1986·Granted Nov 24, 1987·50 cites·20 claims
- 2088US6713779B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Mar 30, 2004·47 cites·16 claims
- 2184US6943385B2Semiconductor apparatus with monocrystal insulating filmTOSHIBA KK·Filed 2003·Granted Sep 13, 2005·29 cites·10 claims
- 2284US6917096B2Semiconductor device and method of manufacturing substrateTOSHIBA KK·Filed 2003·Granted Jul 12, 2005·26 cites·7 claims
- 2382US6922910B2Exposure apparatusNIKON CORP·Filed 2003·Granted Aug 2, 2005·20 cites·22 claims
- 2482US4642080APower transmission beltMITSUBOSHI BELTING LTD·Filed 1985·Granted Feb 10, 1987·51 cites·39 claims
- 2580US8518543B2DLC-coated sliding member and method for producing the sameKANO MAKOTO·Filed 2009·Granted Aug 27, 2013·5 cites·14 claims
- 2679US7659537B2Field effect transistorTOSHIBA KK·Filed 2006·Granted Feb 9, 2010·6 cites·2 claims
- 2778US7229892B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Granted Jun 12, 2007·6 cites·9 claims
- 2877US8431459B2Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor deviceTAKENAKA MITSURU·Filed 2009·Granted Apr 30, 2013·9 cites·5 claims
- 2975US8174095B2Semiconductor device and manufacturing method thereofIRISAWA TOSHIFUMI·Filed 2011·Granted May 8, 2012·5 cites·18 claims
- 3075US6801553B2Wavelength monitor and semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 5, 2004·12 cites·40 claims
- 3174US6102823AToothed power transmission beltMITSUBOSHI BELTING LTD·Filed 1992·Granted Aug 15, 2000·29 cites·32 claims
- 3272US7557018B2Element fabrication substrateTOSHIBA KK·Filed 2006·Granted Jul 7, 2009·6 cites·4 claims
- 3372US7154126B2Feed through structure for optical semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 26, 2006·11 cites·12 claims
- 3472US7009200B2Field effect transistorTOSHIBA KK·Filed 2003·Granted Mar 7, 2006·14 cites·9 claims
- 3571US11227953B2Tunneling field effect transistorJAPAN SCIENCE & TECH AGENCY·Filed 2018·Granted Jan 18, 2022·1 cites·20 claims
- 3671US5473435AMethod of measuring the bent shape of a movable mirror of an exposure apparatusNIKON CORP·Filed 1994·Granted Dec 5, 1995·25 cites·20 claims
- 3770US7033913B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Apr 25, 2006·13 cites·14 claims
- 3870USD505664SOptical packageMITSUBISHI ELECTRIC CORP·Filed 2003·Granted May 31, 2005·16 cites·1 claims
- 3967US6791150B2Optical module and optical transceiver apparatusMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Sep 14, 2004·13 cites·19 claims
- 4067USD484105SOptical moduleMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 23, 2003·14 cites·1 claims
- 4166US7005676B2Semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted Feb 28, 2006·11 cites·24 claims
- 4265US6740963B2Optical moduleMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 25, 2004·7 cites·12 claims
- 4363US9112035B2Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrateYAMADA HISASHI·Filed 2012·Granted Aug 18, 2015·2 cites·10 claims
- 4463USD483338SOptical moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 9, 2003·12 cites·1 claims
- 4562US9117658B2Method of producing semiconductor wafer, semiconductor wafer, method of producing semiconductor device and semiconductor deviceSUMITOMO CHEMICAL CO·Filed 2013·Granted Aug 25, 2015·1 cites·3 claims
- 4662US7148965B2Wavelength monitor, optical module, and optical module packaging methodMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 12, 2006·10 cites·23 claims
- 4761US8901656B2Semiconductor wafer, field-effect transistor, method of producing semiconductor wafer, and method of producing field-effect transistorSUMITOMO CHEMICAL CO·Filed 2013·Granted Dec 2, 2014·1 cites·9 claims
- 4861USD494147SOptical moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Aug 10, 2004·11 cites·1 claims
- 4961US4781658APower transmission mechanismMITSUBOSHI BELTING LTD·Filed 1983·Granted Nov 1, 1988·15 cites·19 claims
- 5060US4734087AHigh load transmission beltMITSUBOSHI BELTING LTD·Filed 1987·Granted Mar 29, 1988·14 cites·29 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →