Inventor · disambiguated record
Shunsuke Takagi
Also filed as: TAKAGI SHUNSUKE
7 granted patents·9 pending applications·55 citations·filing 1997–2025
80Inventor score
Top patents by PatentIndex Score
16 records- 0170US8028202B2Data management device and data managing method for the replication of dataFUJITSU LTD·Filed 2010·Granted Sep 27, 2011·3 cites·15 claims
- 0268US6087880ALevel shifterSONY CORP·Filed 1997·Granted Jul 11, 2000·26 cites·17 claims
- 0365US2024352287A1Curable adhesive composition, filmy adhesive, method for producing multilayered wiring board, and multilayered wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0463US5912577ALevel shift circuitSONY CORP·Filed 1998·Granted Jun 15, 1999·22 cites·2 claims
- 0562US2025249344A1Program, method, information processing device, and systemTHE POKEMON COMPANY·Filed 2025·Application pending·0 cites
- 0662US2025249368A1Program, method, information processing device, and systemTHE POKEMON COMPANY·Filed 2025·Application pending·0 cites
- 0760US11137530B2Wide-band wavelength film, method for producing same, and method for producing circular polarization filmZEON CORP·Filed 2017·Granted Oct 5, 2021·0 cites·11 claims
- 0859US11366258B2Wide-band wavelength film, method for producing same, and method for producing circular polarization filmZEON CORP·Filed 2017·Granted Jun 21, 2022·0 cites·11 claims
- 0957US2025064693A1Emulsion compositionKAO CORP·Filed 2022·Application pending·0 cites
- 1053US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 1153US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 1252US7058674B2Random number data generatorSONY CORP·Filed 2003·Granted Jun 6, 2006·4 cites·13 claims
- 1352US2025024609A1Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 1450US11564871B2Dispersion of fine lipid particle dispersionKAO CORP·Filed 2018·Granted Jan 31, 2023·0 cites·7 claims
- 1550US2024079345A1Electroconductive member, method for manufacturing electronic device, connection structure, and electronic deviceSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1648US2010138687A1Recording medium storing failure isolation processing program, failure node isolation method, and storage systemFUJITSU LTD·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →