Inventor · disambiguated record
Shinobu Takahama
Also filed as: TAKAHAMA SHINOBU
8 granted patents·190 citations·filing 1986–1996
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0179US5646445ASemiconductor device having electrodes embedded in an insulating caseMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jul 8, 1997·67 cites·20 claims
- 0270US5792676AMethod of fabricating power semiconductor device and lead frameMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 11, 1998·46 cites·12 claims
- 0365US5430330ASemiconductor device, resin for sealing same and method of fabricating sameMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 4, 1995·34 cites·25 claims
- 0448US5038194ASemiconductor deviceTAKAHAMA SHINOBU·Filed 1987·Granted Aug 6, 1991·18 cites·13 claims
- 0546US4677741AMethod of manufacturing package for high power integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Jul 7, 1987·15 cites·2 claims
- 0636US5539218ASemiconductor device and resin for sealing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jul 23, 1996·7 cites·23 claims
- 0724US5336364AMethod of manufacturing insulation substrate for semiconductor device and metal pattern plate used thereforMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Aug 9, 1994·2 cites·16 claims
- 0823US5271993AMethod of manufacturing insulation substrate for semiconductor device and metal pattern plate used thereforMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 21, 1993·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →