Inventor · disambiguated record
Shinji Takeda
Also filed as: TAKEDA SHINJI
52 granted patents·6 pending applications·755 citations·filing 1977–2022
99Inventor score
Top patents by PatentIndex Score
58 records- 0191US7738374B2Channel allocation for access point in mesh networkNTT DOCOMO INC·Filed 2005·Granted Jun 15, 2010·20 cites·9 claims
- 0288US7620010B2Wireless communications apparatus, and routing control and packet transmission technique in wireless networkNTT DOCOMO INC·Filed 2005·Granted Nov 17, 2009·17 cites·8 claims
- 0385US7990863B2Channel allocation for access point in mesh networkNTT DOCOMO INC·Filed 2007·Granted Aug 2, 2011·11 cites·3 claims
- 0485US7751360B2Packet transmission system, wireless basestation, and route optimization for packet transmissionNTT DOCOMO INC·Filed 2005·Granted Jul 6, 2010·13 cites·17 claims
- 0583US7702280B2Mobile communication system, transmission station, reception station, relay station, communication path deciding method, and communication path deciding programNTT DOCOMO INC·Filed 2003·Granted Apr 20, 2010·27 cites·16 claims
- 0683US4094056ADecorative trim stripAISIN SEIKI·Filed 1977·Granted Jun 13, 1978·39 cites·7 claims
- 0782US8031720B2Packet transfer system, radio base station, and packet transfer route optimization methodNTT DOCOMO INC·Filed 2005·Granted Oct 4, 2011·10 cites·14 claims
- 0880US7881660B2Mobile communication system, transmitting station, receiving station, relay station, communication path determining method, and communication path determining programNTT DOCOMO INC·Filed 2007·Granted Feb 1, 2011·6 cites·9 claims
- 0980US7586894B2Communication system capable of selecting optimum gateway for terminalsNTT DOCOMO INC·Filed 2005·Granted Sep 8, 2009·9 cites·11 claims
- 1079US6014318AResin-sealed type ball grid array IC package and manufacturing method thereofNEC CORP·Filed 1998·Granted Jan 11, 2000·58 cites·9 claims
- 1178US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 1278US5667899AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 16, 1997·35 cites·7 claims
- 1378US4883253ABall valve and methods of fabricationSEIKISUI CHEMICAL CO LTD·Filed 1986·Granted Nov 28, 1989·30 cites·12 claims
- 1477US7519029B2Radio communication system, base station, relay station, mobile station, and packet transmission control methodNTT DOCOMO INC·Filed 2002·Granted Apr 14, 2009·22 cites·63 claims
- 1575US7948891B2Wireless communication apparatus, communication routing control apparatus, communication routing control method and communication systemNTT DOCOMO INC·Filed 2006·Granted May 24, 2011·6 cites·13 claims
- 1675US7352729B2Wireless communication system for multi-hop connection, source station, radio station and pilot signal used thereinNTT DOCOMO INC·Filed 2003·Granted Apr 1, 2008·23 cites·10 claims
- 1773US6743500B2Hollow carbon fiber and production methodHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 1, 2004·9 cites·17 claims
- 1872US7116592B2Semiconductor device and test method thereofTOSHIBA KK·Filed 2005·Granted Oct 3, 2006·9 cites·9 claims
- 1972US5243019AAlkenyl-fluorine-containing aromatic polyamideHITACHI CHEMICAL CO LTD·Filed 1991·Granted Sep 7, 1993·18 cites·8 claims
- 2071US8574716B2Ionic polymer devices and methods of fabricating the sameWU YONGXIAN·Filed 2009·Granted Nov 5, 2013·8 cites·35 claims
- 2171US5605763AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Feb 25, 1997·40 cites·9 claims
- 2270US7274616B2Integrated circuit apparatusNEC ELECTRONICS CORP·Filed 2006·Granted Sep 25, 2007·8 cites·19 claims
- 2370US5270438AFluorine-containing polyimides and precursors thereofHITACHI CHEMICAL CO LTD·Filed 1991·Granted Dec 14, 1993·14 cites·20 claims
- 2469US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 2568US7619998B2Multi-hop communication system, radio control station, radio station and multi-hop communication methodNTT DOCOMO INC·Filed 2004·Granted Nov 17, 2009·13 cites·12 claims
- 2668US4737090AMovable vane compressorNIPPON DENSO CO·Filed 1986·Granted Apr 12, 1988·20 cites·9 claims
- 2767US7907890B2Mobile communication system, transmitting station, receiving station, relay station, communication path determining method, and communication path determining programNTT DOCOMO INC·Filed 2007·Granted Mar 15, 2011·2 cites·7 claims
- 2867US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 2967US6641792B2Hollow carbon fiber and production methodHITACHI CHEMICAL CO LTD·Filed 2002·Granted Nov 4, 2003·5 cites·28 claims
- 3066US7273652B2Hollow carbon fiber and production methodHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 25, 2007·5 cites·31 claims
- 3166US6754836B2Microcomputer capable of switching between low current consumption mode and normal operation modeRENESAS TECH CORP·Filed 2000·Granted Jun 22, 2004·13 cites·6 claims
- 3266US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 3366US4579755ALongitudinal molding with nonuniform sectionsAISIN SEIKI·Filed 1984·Granted Apr 1, 1986·16 cites·1 claims
- 3462US4489019AMethod for producing a longitudinal molding with nonuniform sectionsAISIN SEIKI·Filed 1982·Granted Dec 18, 1984·18 cites·7 claims
- 3560US7876619B2Nonvolatile semiconductor memory deviceTOSHIBA KK·Filed 2009·Granted Jan 25, 2011·4 cites·19 claims
- 3660US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 3760US5042871AGlass pane for use in a vehicleAISIN SEIKI·Filed 1990·Granted Aug 27, 1991·26 cites·2 claims
- 3860US4094725AApparatus for hot gas welding of a pair of thermoplastic materialsAISIN SEIKI·Filed 1977·Granted Jun 13, 1978·20 cites·7 claims
- 3959US4813649ABall valveSEIKISUI CHEMICAL CO LTD·Filed 1987·Granted Mar 21, 1989·15 cites·3 claims
- 4058US4450038AHot air blast welding apparatus for thermoplastic partsAISIN SEIKI·Filed 1982·Granted May 22, 1984·18 cites·3 claims
- 4156US4960262ABall valve and methods of fabricationSEIKISUI CHEMICAL CO LTD·Filed 1989·Granted Oct 2, 1990·13 cites·2 claims
- 4256US2024242165A1Information Processing System, Management Method of Warehouse, and Warehouse Control ApparatusHITACHI INDUSTRIAL PRODUCTS LTD·Filed 2022·Application pending·0 cites
- 4354US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 4453US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 4553US4869450ABall valveSEIKISUI CHEMICAL CO LTD·Filed 1989·Granted Sep 26, 1989·12 cites·9 claims
- 4653US4667926ABall valveSEIKISUI CHEMICAL CO LTD·Filed 1986·Granted May 26, 1987·18 cites·5 claims
- 4751US2008070086A1Phase-Separated Polymer Electrolyte Membrane, Electrode - Phase-Separated Polymer Electrolyte Membrane Joint Using Same, Method for Manufacture Thereof, and Fuel Cell Using SameFUKUCHI IWAO·Filed 2007·Application pending·0 cites
- 4850US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 4947US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 5046US7720466B2Radio control station, radio terminal, base station, communication system, and communication methodNTT DOCOMO INC·Filed 2004·Granted May 18, 2010·0 cites·13 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →