Inventor · disambiguated record
Shozui Takeno
Also filed as: TAKENO SHOZUI
10 granted patents·5 pending applications·398 citations·filing 1991–2017
92Inventor score
Files withMITSUBISHI ELECTRIC CORP12
Top patents by PatentIndex Score
15 records- 0196US6875951B2Laser machining deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 5, 2005·135 cites·18 claims
- 0283US6136668AMethod of dicing semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 24, 2000·62 cites·4 claims
- 0380US6633376B1Apparatus for inspecting a printed circuit boardMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 14, 2003·55 cites·21 claims
- 0479US6972392B2Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring boardMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 6, 2005·18 cites·3 claims
- 0578US6373026B1Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring boardMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 16, 2002·17 cites·1 claims
- 0676US6690024B1Laser inspection apparatusMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 10, 2004·15 cites·12 claims
- 0775US5585018ALaser cutting method eliminating defects in regions where cutting conditions are changedMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Dec 17, 1996·42 cites·22 claims
- 0870US6329671B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 11, 2001·12 cites·4 claims
- 0957US5178725AMethod for working ceramic materialMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jan 12, 1993·22 cites·22 claims
- 1054US5532434AInsulated wireMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 2, 1996·20 cites·17 claims
- 1149US2005184035A1Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locationsMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1238US2005121613A1Laser beam machining methodFiled 2003·Application pending·0 cites
- 1337US2004173942A1Method and device for laser beam machining of laminated materialFiled 2002·Application pending·0 cites
- 1433US2020105572A1Heat treatment device, heat treatment method, laser annealing device, and laser annealing methodMITSUBISHI ELECTRIC CORP·Filed 2017·Application pending·0 cites
- 1528US2003146196A1Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring boardFiled 1996·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →