Inventor · disambiguated record
Shuichi Tanaka
Also filed as: TANAKA SHUICHI
70 granted patents·11 pending applications·448 citations·filing 1985–2024
98Inventor score
Top patents by PatentIndex Score
81 records- 0197US7246432B2Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Jul 24, 2007·67 cites·6 claims
- 0294US10259215B2Liquid jet head and method for manufacturing liquid jet headSEIKO EPSON CORP·Filed 2016·Granted Apr 16, 2019·5 cites·8 claims
- 0390US9889655B2Liquid ejecting head and method of manufacturing liquid ejecting headSEIKO EPSON CORP·Filed 2016·Granted Feb 13, 2018·3 cites·4 claims
- 0490US7714436B2Electronic device and electronic apparatusSEIKO EPSON CORP·Filed 2008·Granted May 11, 2010·10 cites·6 claims
- 0589US7276792B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2005·Granted Oct 2, 2007·8 cites·12 claims
- 0687US7166920B2Electronic component, mounted structure, electro-optical device, and electronic deviceSEIKO EPSON CORP·Filed 2005·Granted Jan 23, 2007·22 cites·12 claims
- 0786US7122896B2Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic componentSEIKO EPSON CORP·Filed 2004·Granted Oct 17, 2006·43 cites·21 claims
- 0883US7348269B2Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Mar 25, 2008·12 cites·14 claims
- 0983US6034624AInduction-type linear position detector deviceGOTO ATSUTOSHI·Filed 1997·Granted Mar 7, 2000·59 cites·19 claims
- 1082US12239025B2Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatusSEIKO EPSON CORP·Filed 2024·Granted Feb 25, 2025·0 cites·4 claims
- 1181US9751306B2Piezoelectric device, liquid ejecting head and method for manufacturing piezoelectric deviceSEIKO EPSON CORP·Filed 2016·Granted Sep 5, 2017·2 cites·6 claims
- 1281US2025133966A1Mounting Structure, Ultrasonic Device, Ultrasonic Probe, Ultrasonic Apparatus, And Electronic ApparatusSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 1379US10220619B2MEMS device, head and liquid jet deviceSEIKO EPSON CORP·Filed 2016·Granted Mar 5, 2019·2 cites·6 claims
- 1479US8106509B2Electronic device and electronic apparatusTANAKA SHUICHI·Filed 2010·Granted Jan 31, 2012·2 cites·6 claims
- 1579US6552666B1Phase difference detection device and method for a position detectorGOTO ATSUTOSHI·Filed 2000·Granted Apr 22, 2003·27 cites·7 claims
- 1678US11917922B2Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatusSEIKO EPSON CORP·Filed 2023·Granted Feb 27, 2024·0 cites·3 claims
- 1777US9810550B2Position detection deviceAMITEQ CO LTD·Filed 2013·Granted Nov 7, 2017·3 cites·4 claims
- 1877US7888799B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2010·Granted Feb 15, 2011·2 cites·15 claims
- 1976US7830007B2Electronic device, method of producing the same, and semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Nov 9, 2010·6 cites·9 claims
- 2075US7741712B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2007·Granted Jun 22, 2010·2 cites·18 claims
- 2172US7910498B2Method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Mar 22, 2011·4 cites·6 claims
- 2271US7576424B2Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Aug 18, 2009·5 cites·3 claims
- 2371US7524700B2Method for manufacturing semiconductor device, and method and structure for implementing semicondutor deviceSEIKO EPSON CORP·Filed 2006·Granted Apr 28, 2009·6 cites·8 claims
- 2471US7341335B2Liquid ejection apparatusSEIKO EPSON CORP·Filed 2005·Granted Mar 11, 2008·3 cites·12 claims
- 2569US10773517B2Liquid jet head and method for manufacturing liquid jet headSEIKO EPSON CORP·Filed 2019·Granted Sep 15, 2020·0 cites·7 claims
- 2669US7629671B2Semiconductor device having a resin protrusion with a depression and method manufacturing the sameSEIKO EPSON CORP·Filed 2006·Granted Dec 8, 2009·4 cites·4 claims
- 2769US5903205AInduction-type rotational position detecting deviceATSUTOSHI GOTO·Filed 1996·Granted May 11, 1999·28 cites·17 claims
- 2868US9534954B2Optical filter device, optical module, and electronic apparatusSEIKO EPSON CORP·Filed 2012·Granted Jan 3, 2017·2 cites·18 claims
- 2967US7790595B2Manufacturing method improving the reliability of a bump electrodeSEIKO EPSON CORP·Filed 2006·Granted Sep 7, 2010·4 cites·2 claims
- 3067US6885310B2Phase difference detection device and method for a position detectorFiled 2003·Granted Apr 26, 2005·10 cites·8 claims
- 3164US7936073B2Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2010·Granted May 3, 2011·1 cites·10 claims
- 3264US7601626B2Method for manufacturing semiconductor device, and method and structure for implementing semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Oct 13, 2009·4 cites·2 claims
- 3363US10245833B2Liquid ejecting head and method of manufacturing liquid ejecting headSEIKO EPSON CORP·Filed 2018·Granted Apr 2, 2019·0 cites·3 claims
- 3463US8142602B2Method for mounting semiconductor deviceTANAKA SHUICHI·Filed 2009·Granted Mar 27, 2012·2 cites·4 claims
- 3563US7825518B2Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2010·Granted Nov 2, 2010·1 cites·10 claims
- 3663US7143504B2Method of manufacturing a display structureSEIKO EPSON CORP·Filed 2003·Granted Dec 5, 2006·9 cites·11 claims
- 3761US8183690B2Electronic deviceTANAKA SHUICHI·Filed 2008·Granted May 22, 2012·2 cites·7 claims
- 3860US7671476B2Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2006·Granted Mar 2, 2010·1 cites·10 claims
- 3959US8421248B2Electronic device and electronic apparatusTANAKA SHUICHI·Filed 2012·Granted Apr 16, 2013·0 cites·12 claims
- 4058US8407406B2Semiconductor memory device and method of testing the sameTANAKA SHUICHI·Filed 2010·Granted Mar 26, 2013·2 cites·12 claims
- 4158US7375427B2Semiconductor device, circuit board, electro-optic device, electronic deviceSEIKO EPSON CORP·Filed 2005·Granted May 20, 2008·1 cites·20 claims
- 4257US10272686B2MEMS device, liquid ejecting head, manufacturing method of MEMS device, and manufacturing method of liquid ejecting headSEIKO EPSON CORP·Filed 2017·Granted Apr 30, 2019·0 cites·6 claims
- 4357US8508042B2Electronic device and electronic apparatusTANAKA SHUICHI·Filed 2011·Granted Aug 13, 2013·0 cites·12 claims
- 4457US7429704B2Electronic component, electro-optical device, and electronic apparatusSEIKO EPSON CORP·Filed 2006·Granted Sep 30, 2008·1 cites·7 claims
- 4556US10377134B2MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing methodSEIKO EPSON CORP·Filed 2017·Granted Aug 13, 2019·0 cites·18 claims
- 4656US9925770B2Wiring substrate, MEMS device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Mar 27, 2018·0 cites·20 claims
- 4756US5900641AField effect semiconductor device having a reduced leakage currentFUJITSU LTD·Filed 1997·Granted May 4, 1999·16 cites·9 claims
- 4853US11043625B2Piezoelectric device, MEMS device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2018·Granted Jun 22, 2021·0 cites·20 claims
- 4953US6133594ACompound semiconductor deviceFUJITSU LTD·Filed 1998·Granted Oct 17, 2000·14 cites·11 claims
- 5053US2001027440A1Method of electronic credit serviceFiled 2001·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →