Inventor · disambiguated record
Shin-Luh Tarng
Also filed as: TARNG SHIN-LUH
11 granted patents·5 pending applications·18 citations·filing 2009–2024
84Inventor score
Top patents by PatentIndex Score
16 records- 0193US12111114B2Heat transfer element, method for forming the same and semiconductor structure comprising the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 8, 2024·5 cites·8 claims
- 0293US11742324B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 29, 2023·2 cites·12 claims
- 0388US10586716B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 10, 2020·7 cites·21 claims
- 0486US11011496B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·3 cites·17 claims
- 0581US12166009B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 0670US10861726B2Apparatus and method for measuring warpageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 8, 2020·1 cites·27 claims
- 0761US11164756B2Semiconductor device package having continously formed tapered protrusionsADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 2, 2021·0 cites·18 claims
- 0860US2010239857A1Structure of embedded-trace substrate and method of manufacturing the sameTARNG SHIN-LUH·Filed 2009·Application pending·0 cites
- 0959US2013122216A1Structure of embedded-trace substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2013·Application pending·0 cites
- 1054US2025226364A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1151US11410934B2Substrate and semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 1248US11205606B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 21, 2021·0 cites·20 claims
- 1348US8431007B2Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the sameTARNG SHIN-LUH·Filed 2009·Granted Apr 30, 2013·0 cites·18 claims
- 1439US10872861B2Semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 22, 2020·0 cites·16 claims
- 1539US2022056589A1Electroless semiconductor bonding structure, electroless plating system and electroless plating method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1630US2019127573A1Polylactic acid resin composition and application thereofADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shin-Luh Tarng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →