Inventor · disambiguated record
Shunsuke Tonouchi
Also filed as: TONOUCHI SHUNSUKE
1 granted patent·2 pending applications·0 citations·filing 2017–2023
10Inventor score
Top patents by PatentIndex Score
3 records- 0157US2024247120A1Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0254US10876000B2Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible moduleHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·20 claims
- 0348US2025234458A1Metal-clad laminate, printed wiring board, semiconductor package, and method for manufacturing sameRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →