Inventor · disambiguated record
Shinji Toyosaki
Also filed as: TOYOSAKI SHINJI
3 granted patents·34 citations·filing 1997–1998
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0149US6105848AWire bonding method, wire bonding apparatus and semiconductor device produced by the sameMITSUBISHI DENKI KABUSHKI KAIS·Filed 1998·Granted Aug 22, 2000·14 cites·6 claims
- 0244US6112969AWire bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Sep 5, 2000·11 cites·1 claims
- 0341US5838071AWire bonding method, wire bonding apparatus and semiconductor device produced by the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 17, 1998·9 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →