Inventor · disambiguated record
Sheng-Tai Tsai
Also filed as: TSAI SHENG T · TSAI SHENG-TAI
1 granted patent·4 pending applications·18 citations·filing 2005–2008
41Inventor score
Top patents by PatentIndex Score
5 records- 0186US7368806B2Flip chip package with anti-floating structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 6, 2008·18 cites·8 claims
- 0246US2008179739A1Flip chip package with anti-floating structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 0343US2006051894A1Method for bonding flip chip on leadframeADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0437US2006084199A1Processing method during a package processADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0535US2006084202A1Wafer Level Process for Manufacturing Leadframes and Device from the SameLIU CHIEN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →