Inventor · disambiguated record
Shang-Lun Tsai
Also filed as: TSAI SHANG-LUN
7 granted patents·8 pending applications·4 citations·filing 2015–2025
74Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15
Top patents by PatentIndex Score
15 records- 0191US12272629B2Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·2 cites·20 claims
- 0284US12355001B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·19 claims
- 0383US11705420B2Multi-bump connection to interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 0476US2024379516A1Hybrid organic and non-organic interposer with embedded component and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0575US2025316658A1Double side integration semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0674US2025309090A1Redistribution layer structure with support features and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0773US2025246527A1Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0871US2025316645A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0969US12368142B2Double side integration semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1069US2023317661A1Multi-Bump Connection to Interconnect Structure and Manufacturing Method ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1168US12354940B2Redistribution layer structure with support features and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1266US12494436B2Integrated passive device dies and methods of forming and placement of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 1350US2022406723A1Interposer via interconnect shapes with improved performance characteristics and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1449US9910350B2Method for repairing a maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 6, 2018·0 cites·20 claims
- 1547US2023137691A1Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →