Inventor · disambiguated record
Shu-Jung Tseng
Also filed as: TSENG SHU-JUNG
8 granted patents·3 pending applications·18 citations·filing 2003–2025
80Inventor score
Top patents by PatentIndex Score
11 records- 0195US11251114B2Package substrate insulation opening designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0293US11817382B2Package substrate insulation opening designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0386US2025364519A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0482US11600562B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·1 cites·20 claims
- 0578US12368092B2Package substrate insulation opening designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 0677US12107038B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0777US2024371745A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0877US2024387497A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0968US12469834B2Semiconductor package and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 11, 2025·0 cites·20 claims
- 1065US6957116B2Quality assurance system and methodTAIWAN SEMICONDUCTOR MANUFCTUR·Filed 2003·Granted Oct 18, 2005·11 cites·20 claims
- 1138US7521266B2Production and packaging control for repaired integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 21, 2009·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →