Inventor · disambiguated record
Shih-Hao Tseng
Also filed as: TSENG SHIH-HAO
12 granted patents·8 pending applications·74 citations·filing 2010–2025
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13TSENG SHIH-HAO4AT & T IP I LP1K H S MUSICAL INSTR CO LTD1TAIWAN SEMICODUCTOR MFG CO LTD1
Top patents by PatentIndex Score
20 records- 0195US8471995B2Flexible display panelTSENG SHIH-HAO·Filed 2010·Granted Jun 25, 2013·66 cites·15 claims
- 0288US11031342B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·5 cites·20 claims
- 0382US11056412B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·2 cites·20 claims
- 0482US2025347865A1Optical fiber coupling structure for photonic packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0581US2025293106A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US2025306300A1Optical fiber coupling structure for photonic packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0775US12341072B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 0872US10361139B2Semicondcutor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·1 cites·20 claims
- 0971US11495507B2Manufacturing method of a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
- 1066US11495506B2Semiconductor package with separate electric and thermal pathsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 1165US12476157B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·20 claims
- 1263US11948890B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1361US2025357250A1Method for forming thermal conductor material film and stacking structure formd therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1456US2025038073A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1554US2024250036A1Semiconductor package and methodTAIWAN SEMICODUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1643US10411990B2Routing stability in hybrid software-defined networking networksAT & T IP I LP·Filed 2017·Granted Sep 10, 2019·0 cites·20 claims
- 1742US8586155B2Display deviceTSENG SHIH-HAO·Filed 2011·Granted Nov 19, 2013·0 cites·8 claims
- 1842US2012193656A1Display device structure and manufacturing method thereofTSENG SHIH-HAO·Filed 2012·Application pending·0 cites
- 1941US9159304B1Bore-variable leadpipe for brass instrumentsK H S MUSICAL INSTR CO LTD·Filed 2014·Granted Oct 13, 2015·0 cites·8 claims
- 2036US2012168790A1Display device structure and manufacturing method thereofTSENG SHIH-HAO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →