Inventor · disambiguated record
Shinjiro Tsuji
Also filed as: TSUJI SHINJIRO
18 granted patents·158 citations·filing 1986–2022
92Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD6PANASONIC IP MAN CO LTD5PANASONIC CORP4ODAWARA KOZO1SODICK CO LTD1
Top patents by PatentIndex Score
18 records- 0183US4670287AMethod of film-coating hard capsulesWASHU KIRAI KOGYO KK·Filed 1986·Granted Jun 2, 1987·82 cites·12 claims
- 0281US10479061B2Component bonding devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Nov 19, 2019·2 cites·5 claims
- 0380US7803231B2Substrate edge part cleaning apparatus and substrate edge part cleaning methodPANASONIC CORP·Filed 2005·Granted Sep 28, 2010·7 cites·2 claims
- 0472US9739300B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 22, 2017·2 cites·3 claims
- 0572US7716818B2Method for transferring a substratePANASONIC CORP·Filed 2006·Granted May 18, 2010·4 cites·2 claims
- 0671US8062450B2Tape splicing apparatus and attaching apparatusODAWARA KOZO·Filed 2006·Granted Nov 22, 2011·6 cites·3 claims
- 0769US7021357B2Component mounting apparatus and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 4, 2006·13 cites·8 claims
- 0861US7089073B2Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panelMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 8, 2006·8 cites·18 claims
- 0959US7220922B2Electronic component, component mounting equipment, and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 22, 2007·12 cites·20 claims
- 1058US7653989B2Substrate processing apparatus and mounterPANASONIC CORP·Filed 2005·Granted Feb 2, 2010·1 cites·10 claims
- 1146US11498119B1Injection device of light metal injection molding machineSODICK CO LTD·Filed 2022·Granted Nov 15, 2022·0 cites·9 claims
- 1246US7285175B2Adhesive sheet stamping device, adhesive sheet stamping methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 23, 2007·2 cites·5 claims
- 1343US7799142B2Apparatus and method for cleaning a board terminalPANASONIC CORP·Filed 2006·Granted Sep 21, 2010·0 cites·2 claims
- 1442US5575059ATape carrier package mounting apparatus with heaters for bonding toolsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 19, 1996·11 cites·2 claims
- 1537US9872395B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 16, 2018·0 cites·1 claims
- 1634US10065275B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·4 claims
- 1734US9983421B2Component mounting line and component mounting methodPANASONIC IP MAN CO LTD·Filed 2015·Granted May 29, 2018·0 cites·8 claims
- 1834US5766402AApparatus for applying tape to object by applying pressure theretoMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 16, 1998·8 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →