Inventor · disambiguated record
Shinichi Uchida
Also filed as: UCHIDA SHINICHI
77 granted patents·12 pending applications·701 citations·filing 1986–2021
99Inventor score
Files withRENESAS ELECTRONICS CORP36SUMITOMO WIRING SYSTEMS11UCHIDA SHINICHI10DEXERIALS CORP8NIPPON CATALYTIC CHEM IND6
Top patents by PatentIndex Score
89 records- 0199USD323143SHousing for an electrical connectorSUMITOMO WIRING SYSTEMS·Filed 1989·Granted Jan 14, 1992·129 cites·1 claims
- 0295US8611784B2Image forming apparatusUCHIDA SHINICHI·Filed 2011·Granted Dec 17, 2013·14 cites·6 claims
- 0395US7932578B2Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structureRENESAS ELECTRONICS CORP·Filed 2008·Granted Apr 26, 2011·22 cites·7 claims
- 0495US5198581AProcess for producing unsaturated aldehydes and unsaturated acidsNIPPON CATALYTIC CHEM IND·Filed 1991·Granted Mar 30, 1993·68 cites·8 claims
- 0594US4873217ACatalyst for oxidation of olefin or tertiary alcohol and process for production thereofNIPPON CATALYTIC CHEM IND·Filed 1988·Granted Oct 10, 1989·42 cites·15 claims
- 0693US7999386B2Semiconductor device including a guard ring surrounding an inductorRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 16, 2011·22 cites·20 claims
- 0790US8421188B2Semiconductor device including a guard ring surrounding an inductorUCHIDA SHINICHI·Filed 2011·Granted Apr 16, 2013·10 cites·19 claims
- 0889US10115684B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 30, 2018·6 cites·18 claims
- 0989US9589887B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 7, 2017·7 cites·20 claims
- 1088US10232056B2Method for measuring toxicity of human CSFKYOWA HAKKO KIRIN CO LTD·Filed 2015·Granted Mar 19, 2019·3 cites·37 claims
- 1188US8686540B2Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 1, 2014·5 cites·7 claims
- 1288US5218146AProcess for production of acrylic acidNIPPON CATALYTIC CHEM IND·Filed 1991·Granted Jun 8, 1993·35 cites·9 claims
- 1386US8174092B2Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structureUCHIDA SHINICHI·Filed 2011·Granted May 8, 2012·5 cites·4 claims
- 1486US4892856ACatalyst for oxidation of acrolein and process for preparation thereofNIPPON CATALYTIC CHEM IND·Filed 1988·Granted Jan 9, 1990·48 cites·6 claims
- 1584US10446485B2Semiconductor device, electronic circuit having the same, and semiconductor device forming methodRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 15, 2019·3 cites·19 claims
- 1684US8450831B2Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structureUCHIDA SHINICHI·Filed 2012·Granted May 28, 2013·4 cites·8 claims
- 1783US10818591B2Semiconductor device with inductive coupling and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 27, 2020·3 cites·18 claims
- 1883US10734305B2Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor deviceDEXERIALS CORP·Filed 2017·Granted Aug 4, 2020·4 cites·13 claims
- 1983US8907460B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·6 cites·17 claims
- 2083US7486922B2Fixing device and image forming apparatus with separating mechanism pivotable about plural axesKYOCERA MITA CORP·Filed 2006·Granted Feb 3, 2009·7 cites·15 claims
- 2182USD336283SElectrical connector housingSUMITOMO WIRING SYSTEMS·Filed 1989·Granted Jun 8, 1993·19 cites·1 claims
- 2281US7684744B2Fixing device with separation claws and image forming apparatus including the deviceKYOCERA MITA CORP·Filed 2007·Granted Mar 23, 2010·6 cites·12 claims
- 2380USD323316SHousing for electrical connectorSUMITOMO WIRING SYSTEMS·Filed 1989·Granted Jan 21, 1992·18 cites·1 claims
- 2479USD327249SElectrical connector housingSUMITOMO WIRING SYSTEMS·Filed 1989·Granted Jun 23, 1992·17 cites·1 claims
- 2578US9560791B2Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation memberDEXERIALS CORP·Filed 2014·Granted Jan 31, 2017·2 cites·5 claims
- 2678US9029982B2Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structureRENESAS ELECTRONICS CORP·Filed 2014·Granted May 12, 2015·2 cites·9 claims
- 2778US7652344B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Jan 26, 2010·8 cites·14 claims
- 2877US9558967B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 31, 2017·3 cites·12 claims
- 2977US6549740B2Image forming apparatus and fixing device thereforKYOCERA CORP·Filed 2001·Granted Apr 15, 2003·17 cites·39 claims
- 3074US10526519B2Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor deviceDEXERIALS CORP·Filed 2017·Granted Jan 7, 2020·2 cites·8 claims
- 3174US8310034B2Semiconductor deviceUCHIDA SHINICHI·Filed 2010·Granted Nov 13, 2012·5 cites·21 claims
- 3273US10103773B2Semiconductor device and communication circuitRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 3372US8373251B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 12, 2013·4 cites·8 claims
- 3471US10991653B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Apr 27, 2021·1 cites·17 claims
- 3571US9536828B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jan 3, 2017·3 cites·21 claims
- 3671US9437521B2Thermally conductive sheetDEXERIALS CORP·Filed 2016·Granted Sep 6, 2016·2 cites·19 claims
- 3771USD323486SHousing for an electrical connectorSUMITOMO WIRING SYSTEMS·Filed 1989·Granted Jan 28, 1992·13 cites·1 claims
- 3870US9536804B2Method of manufacturing heat conductive sheetDEXERIALS CORP·Filed 2014·Granted Jan 3, 2017·1 cites·8 claims
- 3970US7525172B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Apr 28, 2009·4 cites·8 claims
- 4070US5177260AMethod for production of acrylic acidNIPPON CATALYTIC CHEM IND·Filed 1990·Granted Jan 5, 1993·28 cites·12 claims
- 4170US4665200AMethod for preparing pyromellitic acid and/or pyromellitic anhydrideNIPPON CATALYTIC CHEM IND·Filed 1986·Granted May 12, 1987·28 cites·14 claims
- 4269US8193038B2Method for manufacturing semiconductor device, semiconductor chip, and semiconductor waferUCHIDA SHINICHI·Filed 2010·Granted Jun 5, 2012·2 cites·9 claims
- 4369US7613421B2Fixing device and image forming apparatusKYOCERA MITA CORP·Filed 2006·Granted Nov 3, 2009·3 cites·17 claims
- 4468US11296007B2Thermal conducting sheet, method for manufacturing thermal conducting sheet, heat dissipation member, and semiconductor deviceDEXERIALS CORP·Filed 2017·Granted Apr 5, 2022·1 cites·15 claims
- 4565US5653864AProtein biosensor and method for protein measurement with the sameNOK CORP·Filed 1995·Granted Aug 5, 1997·29 cites·5 claims
- 4664US9252200B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 2, 2016·1 cites·12 claims
- 4762US2022084902A1Thermal Conducting Sheet, Method for Manufacturing Thermal Conducting Sheet, Heat Dissipation Member, and Semiconductor DeviceDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 4860US11276640B2Semiconductor device, electronic circuit having the same, and semiconductor device forming methodRENESAS ELECTRONICS CORP·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 4960USD323154SHousing for electrical connectorSUMITOMO WIRING SYSTEMS·Filed 1989·Granted Jan 14, 1992·8 cites·1 claims
- 5058US8135317B2Development device and image forming apparatus having sameUCHIDA SHINICHI·Filed 2008·Granted Mar 13, 2012·1 cites·12 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →