Inventor · disambiguated record
Shinya Uesaka
Also filed as: UESAKA SHINYA
11 granted patents·2 pending applications·256 citations·filing 1997–2013
92Inventor score
Files withSUMITOMO ELEC HARDMETAL CORP6SUMITOMO ELECTRIC INDUSTRIES5OKAMURA KATSUMI1TANAKA KUNISHIGE1
Top patents by PatentIndex Score
13 records- 0190USD595751SThrowaway insert for metal cutting toolSUMITOMO ELEC HARDMETAL CORP·Filed 2009·Granted Jul 7, 2009·37 cites·1 claims
- 0288USD595322SThrowaway insert for metal cutting toolSUMITOMO ELEC HARDMETAL CORP·Filed 2007·Granted Jun 30, 2009·32 cites·1 claims
- 0387USD595323SThrowaway insert for metal cutting toolSUMITOMO ELEC HARDMETAL CORP·Filed 2009·Granted Jun 30, 2009·31 cites·1 claims
- 0482USD664168SCutting insertOKAMURA KATSUMI·Filed 2011·Granted Jul 24, 2012·28 cites·1 claims
- 0578US8672590B2Cutting insertTANAKA KUNISHIGE·Filed 2011·Granted Mar 18, 2014·7 cites·10 claims
- 0678US6001758AHard and tough sintered bodySUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Dec 14, 1999·36 cites·18 claims
- 0777US7081424B2High-strength, highly thermally conductive sintered compact of cubic boron nitrideSUMITOMO ELEC HARDMETAL CORP·Filed 2004·Granted Jul 25, 2006·15 cites·8 claims
- 0876US6737377B1Cutting tool of a cubic boron nitride sintered compactSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted May 18, 2004·31 cites·6 claims
- 0972US6008153AHigh-pressure phase boron nitride base sinterSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Dec 28, 1999·27 cites·22 claims
- 1052US6716544B2Coated sinter of cubic-system boron nitrideSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Apr 6, 2004·4 cites·18 claims
- 1144US2009202314A1Boring tool and holder for the sameSUMITOMO ELEC HARDMETAL CORP·Filed 2007·Application pending·0 cites
- 1244US2015050092A1Cutting toolSUMITOMO ELEC HARDMETAL CORP·Filed 2013·Application pending·0 cites
- 1341US5890847ACutting tool for millingSUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted Apr 6, 1999·8 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →