Inventor · disambiguated record
Shinji Ueyama
Also filed as: UEYAMA SHINJI
10 granted patents·3 pending applications·5 citations·filing 2005–2025
78Inventor score
Top patents by PatentIndex Score
13 records- 0171US7492942B2Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatusTOKYO SEIMITSU CO LTD·Filed 2005·Granted Feb 17, 2009·4 cites·10 claims
- 0268US12439607B2Inspection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0363US12500107B2Mounting device and mounting methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 0462US11796608B2Magnetic property measurement apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 0561US2025237622A1Device for measuring magnetic characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0658US9726204B2Fluid pressure actuatorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 8, 2017·1 cites·19 claims
- 0758US2024272245A1Semiconductor manufacturing device and semiconductor manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0857US12327579B2Inspection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·12 claims
- 0948US2024094646A1Exposure apparatus and decontamination apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1044US12051604B2Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 1140US10847369B2Wafer bonding method, method for manufacturing semiconductor device, and apparatus thereforSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·15 claims
- 1240US9082885B2Semiconductor chip bonding apparatus and method of forming semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 14, 2015·0 cites·20 claims
- 1338US10444162B2Method of testing an object and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →