Inventor · disambiguated record
Shiori Uota
Also filed as: UOTA SHIORI
10 granted patents·2 pending applications·15 citations·filing 2007–2023
81Inventor score
Top patents by PatentIndex Score
12 records- 0186US10771053B2Semiconductor device having first and second switching regions respectively controlled by first and second control signals output by a controllerMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Sep 8, 2020·5 cites·11 claims
- 0277US7755168B2Semiconductor device provided with floating electrodeMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Jul 13, 2010·6 cites·15 claims
- 0362US9007736B2Power moduleUOTA SHIORI·Filed 2011·Granted Apr 14, 2015·3 cites·15 claims
- 0460US9685862B2Semiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 20, 2017·1 cites·13 claims
- 0557US10812062B2Driving device for semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Oct 20, 2020·0 cites·12 claims
- 0657US2024096743A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0754US2024258254A1Bonding pad, integrated circuit element, and integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0852US11798869B2Semiconductor package with plurality of grooves on lower surfaceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Oct 24, 2023·0 cites·8 claims
- 0950US9800130B2Semiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 24, 2017·0 cites·3 claims
- 1038US10338128B2Life estimation circuit and semiconductor device made using the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 2, 2019·0 cites·16 claims
- 1134US10199340B2Signal transmission insulative device and power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 5, 2019·0 cites·11 claims
- 1232US9182772B2Power device control circuit and power device circuitUOTA SHIORI·Filed 2012·Granted Nov 10, 2015·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →