Inventor · disambiguated record
Sharon Ko Mei Wan
Also filed as: WAN SHARON KO MEI
9 granted patents·176 citations·filing 2000–2004
87Inventor score
Technology areasH10W
Files withNAT SEMICONDUCTOR CORP9
Top patents by PatentIndex Score
9 records- 0193US6777788B1Method and structure for applying thick solder layer onto die attach padNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 17, 2004·96 cites·15 claims
- 0283US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
- 0371US7002239B1Leadless leadframe packaging panel featuring peripheral dummy leadsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Feb 21, 2006·19 cites·21 claims
- 0464US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
- 0562US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
- 0644US6808961B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 26, 2004·1 cites·24 claims
- 0740US6818970B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 16, 2004·0 cites·22 claims
- 0838US6963124B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 8, 2005·0 cites·22 claims
- 0938US6933174B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →