Inventor · disambiguated record
Shao Ping Wan
Also filed as: WAN SHAO PING
4 granted patents·1 pending application·2 citations·filing 2018–2024
60Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG5
Top patents by PatentIndex Score
5 records- 0184US11355460B1Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·2 cites·21 claims
- 0263US11817407B2Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 14, 2023·0 cites·21 claims
- 0361US11444011B2Semiconductor package with leadframe interconnection structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 0461US2025192005A1Semiconductor devices including rounded components and related manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0551US10872848B2Semiconductor package with leadframe interconnection structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 22, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →