Inventor · disambiguated record
Sheng-Ming Wang
Also filed as: WANG SHENG · WANG SHENG-MING
34 granted patents·4 pending applications·86 citations·filing 1998–2024
96Inventor score
Top patents by PatentIndex Score
38 records- 0192US10157887B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 18, 2018·9 cites·20 claims
- 0289US10446411B2Semiconductor device package with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 15, 2019·5 cites·18 claims
- 0386US10629519B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 21, 2020·6 cites·22 claims
- 0486US10573624B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 25, 2020·4 cites·19 claims
- 0586US10049893B2Semiconductor device with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 14, 2018·4 cites·23 claims
- 0686US8884443B2Substrate for semiconductor package and process for manufacturingADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·6 cites·13 claims
- 0785US10134683B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 20, 2018·6 cites·21 claims
- 0885US7550375B2Method for forming metal bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·15 cites·25 claims
- 0977US12444689B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Oct 14, 2025·0 cites·4 claims
- 1077US10224298B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·2 cites·19 claims
- 1173US9984989B2Semiconductor substrate and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 29, 2018·2 cites·13 claims
- 1271US10515884B2Substrate having a conductive structure within photo-sensitive resinADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 24, 2019·2 cites·25 claims
- 1368US9437532B2Substrate for semiconductor package and process for manufacturingADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 6, 2016·1 cites·20 claims
- 1466US7637129B2Air jet pressurized clothes washing machineWANG SHENG-MING·Filed 2007·Granted Dec 29, 2009·3 cites·6 claims
- 1565US9224707B2Substrate for semiconductor package and process for manufacturingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Dec 29, 2015·1 cites·30 claims
- 1665US8779581B2Heat dissipating semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Granted Jul 15, 2014·2 cites·12 claims
- 1764US11894308B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 6, 2024·0 cites·14 claims
- 1864US9911702B2Semiconductor package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Mar 6, 2018·1 cites·24 claims
- 1961US9054118B2Heat dissipating semiconductor device packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jun 9, 2015·1 cites·20 claims
- 2057US10734337B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 4, 2020·0 cites·16 claims
- 2154US10854550B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 1, 2020·0 cites·22 claims
- 2254US10103110B2Semiconductor package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 16, 2018·0 cites·25 claims
- 2348US12328564B2Method and apparatus for performing audio enhancement with aid of timing controlMEDIATEK INC·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 2447US2015048002A1Two Nested and Interlocked Beverage ContainersWANG SHENG MING·Filed 2013·Application pending·0 cites
- 2546US10332851B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·0 cites·10 claims
- 2644US8649852B2Method of signal enhancement for ECG devicesSONG ZHENDONG·Filed 2011·Granted Feb 11, 2014·0 cites·15 claims
- 2743US10049976B2Semiconductor substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 2842US2009032901A1Method of curing hydrogen silsesquioxane and densification in nano-scale trenchesCHEN WEI·Filed 2006·Application pending·0 cites
- 2941US9486150B2Method of signal enhancement for ECG devicesMEDTRONIC INC·Filed 2014·Granted Nov 8, 2016·0 cites·4 claims
- 3041US8866311B2Semiconductor package substrates having pillars and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Oct 21, 2014·0 cites·19 claims
- 3141US2007232051A1Method for forming metal bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 3241US2012168400A1Capped beverage container having an open chamber storing a sealed tube of other beverageWANG SHENG-MING·Filed 2010·Application pending·0 cites
- 3340US8592962B2Semiconductor device packages with protective layer and related methodsCHEN KUANG-HSIUNG·Filed 2011·Granted Nov 26, 2013·0 cites·17 claims
- 3438US8686568B2Semiconductor package substrates having layered circuit segments, and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Apr 1, 2014·0 cites·19 claims
- 3537US10879159B2Substrate, semiconductor package thereof and process of making sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 29, 2020·0 cites·18 claims
- 3637US10002843B2Semiconductor substrate structure, semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 19, 2018·0 cites·20 claims
- 3737US5964014AStructure of an environmental friendly coffinFiled 1998·Granted Oct 12, 1999·16 cites·1 claims
- 3834US10383273B2Coastal severe saline-alkali soil improvement and vegetation construction systemSHANDONG SUNWAY LANDSCAPE TECH CO LTD·Filed 2015·Granted Aug 20, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →