Inventor · disambiguated record
Shizuharu Watanabe
Also filed as: WATANABE SHIZUHARU
23 granted patents·318 citations·filing 1986–2009
96Inventor score
Top patents by PatentIndex Score
23 records- 0195US6156237AConductive paste and circuit substrate formed by use of the pasteMURATA MANUFACTURING CO·Filed 2000·Granted Dec 5, 2000·74 cites·17 claims
- 0290US6885276B2Photosensitive thick film composition and electronic device using the sameMURATA MANUFACTURING CO·Filed 2001·Granted Apr 26, 2005·37 cites·20 claims
- 0389US6183669B1Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrateMURATA MANUFACTURING CO·Filed 2000·Granted Feb 6, 2001·55 cites·18 claims
- 0484US7659568B2Monolithic ceramic capacitor and method for adjusting equivalent series resistance thereofMURATA MANUFACTURING CO·Filed 2007·Granted Feb 9, 2010·14 cites·14 claims
- 0584US6399282B1Method for forming conductive pattern and producing ceramic multi-layer substrateMURATA MANUFACTURING CO·Filed 2000·Granted Jun 4, 2002·24 cites·12 claims
- 0679US8035950B2Resistive paste and monolithic ceramic capacitorMURATA MANUFACTURING CO·Filed 2009·Granted Oct 11, 2011·5 cites·20 claims
- 0774US8227536B2Lead-free solder paste and its useWATANABE SHIZUHARU·Filed 2006·Granted Jul 24, 2012·10 cites·11 claims
- 0870US7777398B2Piezoelectric actuatorMURATA MANUFACTURING CO·Filed 2007·Granted Aug 17, 2010·6 cites·20 claims
- 0970US6365265B1Photosensitive insulating paste and thick-film multi-layer circuit substrateMURATA MANUFACTURING CO·Filed 2000·Granted Apr 2, 2002·14 cites·18 claims
- 1069US4985176AResistive pasteMURATA MANUFACTURING CO·Filed 1988·Granted Jan 15, 1991·15 cites·12 claims
- 1167US6649524B2Method and apparatus for forming glass layer, method and apparatus for forming metal layer, and electronic component manufacturing methodMURATA MANUFACTURING CO·Filed 2000·Granted Nov 18, 2003·10 cites·15 claims
- 1265US6346564B1Paste composition, green sheet, and multilayer substrateMURATA MANUFACTURING CO·Filed 2000·Granted Feb 12, 2002·12 cites·20 claims
- 1358US5036027AResistive paste and resistor material thereforMURATA MANUFACTURING CO·Filed 1990·Granted Jul 30, 1991·12 cites·3 claims
- 1456US6270904B1Insulating pasteMURATA MANUFACTURING CO·Filed 2000·Granted Aug 7, 2001·5 cites·14 claims
- 1555US6534161B1Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the sameMURATA MANUFACTURING CO·Filed 2000·Granted Mar 18, 2003·5 cites·9 claims
- 1654US6403694B1Photosensitive insulating paste and thick film multi-layer circuit substrateMURATA MANUFACTURING CO·Filed 2000·Granted Jun 11, 2002·4 cites·11 claims
- 1747US6602946B2Photosensitive insulating paste and thick film multi-layer circuit substrateMURATA MANUFACTURING CO·Filed 2001·Granted Aug 5, 2003·1 cites·17 claims
- 1837US6270880B1Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit boardMURATA MANUFACTURING CO·Filed 1999·Granted Aug 7, 2001·6 cites·23 claims
- 1934US6191186B1Insulating pasteMURATA MANUFACTURING CO·Filed 1998·Granted Feb 20, 2001·3 cites·14 claims
- 2033US4693843AResistance pasteMURATA MANUFACTURING CO·Filed 1986·Granted Sep 15, 1987·2 cites·4 claims
- 2131US6335298B1Insulating glass paste and thick-film circuit componentMURATA MANUFACTURING CO·Filed 1999·Granted Jan 1, 2002·1 cites·8 claims
- 2231US5064573AResistive paste comprising oxides of ruthenium, lead, iron and zincMURATA MANUFACTURING CO·Filed 1990·Granted Nov 12, 1991·1 cites·8 claims
- 2327US5344503AMethod of preventing oxidation of copper powderMURATA MANUFACTURING CO·Filed 1993·Granted Sep 6, 1994·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →