Inventor · disambiguated record

Shau-Chuo Wen

Also filed as: WEN SHAU-CHUO

1 granted patent·1 pending application·35 citations·filing 2004–2008

45Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG1

Top patents by PatentIndex Score

2 records

0183US7682960B2Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layerADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Mar 23, 2010·35 cites·16 claims
0230US2004207065A1[stack-type multi-chip package and method of fabricating bumps on the backside of a chip]Filed 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →