Inventor · disambiguated record
Sheng-Ping Weng
Also filed as: WENG SHENG-PING
4 granted patents·6 citations·filing 2015–2023
68Inventor score
Technology areasH10P
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0190US11781995B2Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
- 0285US11268913B2Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·2 cites·20 claims
- 0378US12169179B2Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0475US10648927B2Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 12, 2020·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →