Inventor · disambiguated record
Sheng-Feng Weng
Also filed as: WENG SHENG-FENG
26 granted patents·9 pending applications·54 citations·filing 2012–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26HON HAI PREC IND CO LTD6UNIV NAT CHIAO TUNG2LIU SHEN-CHI1
Top patents by PatentIndex Score
35 records- 0198US9818729B1Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·35 cites·20 claims
- 0296US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 0387US12358194B2Molded semiconductor device and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0487US2025303621A1Molding apparatus and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0584US2025132268A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0683US12011859B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 0782US12512419B2Method of fabricating memory device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0882US12218082B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0979US11731327B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1076US2025349799A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1174US12230549B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1274US2025300130A1Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1373US11855006B2Memory device, package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 1472US2025167060A1Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1570US10797025B2Advanced INFO POP and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 6, 2020·1 cites·20 claims
- 1670US2025285953A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1764US12354997B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 1864US11955460B2Advanced info POP and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·20 claims
- 1963US12334424B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2062US11446851B2Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 2162US11309226B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 2257US9503669B2Smart control device and method for controlling television setHON HAI PREC IND CO LTD·Filed 2015·Granted Nov 22, 2016·1 cites·16 claims
- 2355US12512384B2Semiconductor package with electrically conductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2454US10325883B2Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 2553US12354929B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 2653US9646442B2Electronic lock and method for wirelessly unlocking the electronic lockHON HAI PREC IND CO LTD·Filed 2015·Granted May 9, 2017·1 cites·14 claims
- 2753US2024113032A1Packaged interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2852US9079165B2Ethanol reforming catalyst composition and method of producing ethanol reforming catalystUNIV NAT CHIAO TUNG·Filed 2013·Granted Jul 14, 2015·0 cites·3 claims
- 2949US10283470B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·20 claims
- 3045US9623400B2Catalyst for producing hydrogen and preparing method thereofUNIV NAT CHIAO TUNG·Filed 2015·Granted Apr 18, 2017·0 cites·7 claims
- 3144US9338809B2System for coupling mobile device to host computer of automobile and method thereofHON HAI PREC IND CO LTD·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 3238US2013150991A1Data processing module of digital audio processing device, digital audio processing controller module of portable device, and control systemLIU SHEN-CHI·Filed 2012·Application pending·0 cites
- 3337US10503772B2Device and method for recommending multimedia file to userHON HAI PREC IND CO LTD·Filed 2017·Granted Dec 10, 2019·0 cites·10 claims
- 3430US9904402B2Mobile terminal and method for input controlHON HAI PREC IND CO LTD·Filed 2015·Granted Feb 27, 2018·0 cites·15 claims
- 3529US2015294646A1Display apparatus and method for displaying screen images from multiple electronic devicesHON HAI PREC IND CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sheng-Feng Weng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →