Inventor · disambiguated record
Shaw Fong Wong
Also filed as: WONG SHAW FONG
2 granted patents·3 pending applications·0 citations·filing 2007–2021
25Inventor score
Top patents by PatentIndex Score
5 records- 0142US10879219B2Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structureINTEL CORP·Filed 2018·Granted Dec 29, 2020·0 cites·19 claims
- 0239US11664257B2Contactless wafer separatorINTEL CORP·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 0337US2019311978A1Composite stacked interconnects for high-speed applications and methods of assembling sameINTEL CORP·Filed 2019·Application pending·0 cites
- 0435US2009016036A1Conductor reinforcement for circuit boardsWONG SHAW FONG·Filed 2007·Application pending·0 cites
- 0530US2012159118A1Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package StructureWONG SHAW FONG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →