Inventor · disambiguated record
Shih-Hsien Wu
Also filed as: WU SHIH-HSIEN
28 granted patents·8 pending applications·164 citations·filing 2003–2023
95Inventor score
Top patents by PatentIndex Score
36 records- 0196US7633154B2Encapsulation and methods thereofIND TECH RES INST·Filed 2006·Granted Dec 15, 2009·53 cites·12 claims
- 0292US9125304B2Circuit board having via and manufacturing method thereofIND TECH RES INST·Filed 2014·Granted Sep 1, 2015·11 cites·19 claims
- 0391US8035951B2Capacitor devicesIND TECH RES INST·Filed 2010·Granted Oct 11, 2011·13 cites·2 claims
- 0490US9706656B2Signal transmission board and method for manufacturing the sameIND TECH RES INST·Filed 2015·Granted Jul 11, 2017·9 cites·21 claims
- 0585US10448501B2Circuit structureIND TECH RES INST·Filed 2015·Granted Oct 15, 2019·5 cites·19 claims
- 0684US7894172B2ESD protection structureIND TECH RES INST·Filed 2008·Granted Feb 22, 2011·14 cites·28 claims
- 0784US7742276B2Wiring structure of laminated capacitorsIND TECH RES INST·Filed 2007·Granted Jun 22, 2010·12 cites·19 claims
- 0883US7804678B2Capacitor devicesIND TECH RES INST·Filed 2007·Granted Sep 28, 2010·9 cites·14 claims
- 0978US7349196B2Composite distributed dielectric structureIND TECH RES INST·Filed 2005·Granted Mar 25, 2008·8 cites·23 claims
- 1076US8488299B2Capacitor structureWU SHIH-HSIEN·Filed 2010·Granted Jul 16, 2013·4 cites·13 claims
- 1175US10405418B2Differential signal transmitting circuit boardIND TECH RES INST·Filed 2016·Granted Sep 3, 2019·2 cites·17 claims
- 1275US7649723B2ESD protection substrate and integrated circuit utilizing the sameIND TECH RES INST·Filed 2008·Granted Jan 19, 2010·7 cites·18 claims
- 1372US8853848B2Interconnection structure, apparatus therewith, circuit structure therewithWU SHIH-HSIEN·Filed 2011·Granted Oct 7, 2014·4 cites·25 claims
- 1471US9013892B2Chip stacking structureIND TECH RES INST·Filed 2013·Granted Apr 21, 2015·4 cites·17 claims
- 1568US10276908B2Electromagnetic wave transmission board and differential electromagnetic wave transmission boardIND TECH RES INST·Filed 2017·Granted Apr 30, 2019·1 cites·17 claims
- 1667US9258883B2Via structureIND TECH RES INST·Filed 2015·Granted Feb 9, 2016·1 cites·9 claims
- 1767US8071890B2Electrically conductive structure of circuit board and circuit board using the sameHSU CHIEN-MIN·Filed 2008·Granted Dec 6, 2011·3 cites·22 claims
- 1864US7893359B2Embedded capacitor core having a multiple-layer structureIND TECH RES INST·Filed 2006·Granted Feb 22, 2011·2 cites·15 claims
- 1959US2025210498A1Repackaging structureIND TECH RES INST·Filed 2023·Application pending·0 cites
- 2055US11756865B2Electronic device having substrateIND TECH RES INST·Filed 2021·Granted Sep 12, 2023·0 cites·24 claims
- 2154US8227894B2Stepwise capacitor structure and substrate employing the sameLEE MIN-LIN·Filed 2009·Granted Jul 24, 2012·2 cites·41 claims
- 2254US2025139349A1Multi-die integrated package design method and system using the sameIND TECH RES INST·Filed 2023·Application pending·0 cites
- 2352US11363724B1Fabrication method of flexible electronic package deviceIND TECH RES INST·Filed 2020·Granted Jun 14, 2022·0 cites·9 claims
- 2452US11061694B2Reconfigurable data bus system and method thereofIND TECH RES INST·Filed 2019·Granted Jul 13, 2021·0 cites·18 claims
- 2550US2018033772A1Semiconductor device having a rib structure and manufacturing method of the sameIND TECH RES INST·Filed 2017·Application pending·0 cites
- 2649US11239141B2Lead frame packageIND TECH RES INST·Filed 2020·Granted Feb 1, 2022·0 cites·21 claims
- 2747US2024220694A1Power design architectureIND TECH RES INST·Filed 2023·Application pending·0 cites
- 2847US2017170146A1Semiconductor device and manufacturing method of the sameIND TECH RES INST·Filed 2015·Application pending·0 cites
- 2945US2009128993A1Multi-tier capacitor structure, fabrication method thereof and semiconductor substrate employing the sameIND TECHNOLOGY REASERCH INST·Filed 2008·Application pending·0 cites
- 3044US9343393B2Semiconductor substrate assembly with embedded resistance elementIND TECH RES INST·Filed 2014·Granted May 17, 2016·0 cites·23 claims
- 3144US8507909B2Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensorTAIN RA-MIN·Filed 2011·Granted Aug 13, 2013·0 cites·28 claims
- 3243US11955417B2Electronic device having substrate with electrically floating viasIND TECH RES INST·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 3343US9029984B2Semiconductor substrate assemblyIND TECH RES INST·Filed 2013·Granted May 12, 2015·0 cites·11 claims
- 3436US2004211954A1Compositive laminate substrate with inorganic substrate and organic substrateFiled 2003·Application pending·0 cites
- 3534US11469484B2Circuit structureIND TECH RES INST·Filed 2020·Granted Oct 11, 2022·0 cites·13 claims
- 3632US2007164395A1Chip package with built-in capacitor structurePERNG JIIN-SHING·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →