Inventor · disambiguated record
Sheng-Yao Wu
Also filed as: WU SHENG-YAO
0 granted patents·3 pending applications·0 citations·filing 2022–2024
Technology areasH10W
Files withRICHTEK TECHNOLOGY CORP3
Top patents by PatentIndex Score
3 records- 0159US2025233058A1Semiconductor package structure and method of fabricating the sameRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0252US2023163042A1Package structure and packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0349US2023131821A1Heat dissipation structure and high thermal conduction elementRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →