Inventor · disambiguated record
Shinji Yamada
Also filed as: YAMADA SHINJI
115 granted patents·28 pending applications·1,415 citations·filing 1974–2025
99Inventor score
Files withHITACHI LTD13TOSHIBA KK13TYCO ELECTRONICS JAPAN G K9MITSUBISHI ELECTRIC CORP8RENESAS TECH CORP8
Top patents by PatentIndex Score
143 records- 0197US7193471B2High frequency power amplifier circuit and radio communication systemRENESAS TECH CORP·Filed 2006·Granted Mar 20, 2007·43 cites·4 claims
- 0296US11400883B2Occupant protection deviceTOYODA GOSEI KK·Filed 2021·Granted Aug 2, 2022·7 cites·1 claims
- 0396US6550389B1Printing method for printing on can barrelTOYO SEIKAN KAISHA LTD·Filed 2000·Granted Apr 22, 2003·59 cites·11 claims
- 0495US9130127B2Semiconductor light emitting deviceKATSUNO HIROSHI·Filed 2011·Granted Sep 8, 2015·26 cites·15 claims
- 0595US8470723B2Low softening point glass composition, bonding material using same and electronic partsNAITO TAKASHI·Filed 2010·Granted Jun 25, 2013·19 cites·19 claims
- 0695US7123095B2High frequency power amplifier circuit and radio communication systemRENESAS TECH CORP·Filed 2005·Granted Oct 17, 2006·25 cites·11 claims
- 0794US6672296B2Cylinder head structure in multi-cylinder engineHONDA MOTOR CO LTD·Filed 2003·Granted Jan 6, 2004·34 cites·10 claims
- 0894US6513506B1Cylinder head structure in multi-cylinder engineHONDA MOTOR CO LTD·Filed 1999·Granted Feb 4, 2003·74 cites·37 claims
- 0994US5913742ATensioner for an endless transmitting memberHONDA MOTOR CO LTD·Filed 1997·Granted Jun 22, 1999·69 cites·6 claims
- 1094US4505987ASliding memberOILES INDUSTRY CO LTD·Filed 1981·Granted Mar 19, 1985·153 cites·5 claims
- 1191US11648905B2Occupant protection deviceTOYODA GOSEI KK·Filed 2021·Granted May 16, 2023·3 cites·15 claims
- 1291US8367573B2Glass composition and its applicationsHITACHI POWDERED METALS·Filed 2009·Granted Feb 5, 2013·14 cites·37 claims
- 1391US7588463B2Connector and method of producing the sameKYOCERA ELCO CORP·Filed 2008·Granted Sep 15, 2009·44 cites·25 claims
- 1489US6492923B1Test system and testing method using memory testerMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 10, 2002·75 cites·10 claims
- 1588US9184242B2Nitride semiconductor wafer, nitride semiconductor element, and method for manufacturing nitride semiconductor waferTOSHIBA KK·Filed 2014·Granted Nov 10, 2015·6 cites·18 claims
- 1687US11787358B2Occupant protection deviceTOYODA GOSEI KK·Filed 2022·Granted Oct 17, 2023·2 cites·14 claims
- 1787US9960538B2Connector AssemblyTYCO ELECTRONICS JAPAN G K·Filed 2015·Granted May 1, 2018·8 cites·8 claims
- 1886US9553395B2Connector having a barrel and an end bellTYCO ELECTRONICS JAPAN G K·Filed 2015·Granted Jan 24, 2017·7 cites·16 claims
- 1986US8937325B2Semiconductor device, wafer, method for manufacturing semiconductor device, and method for manufacturing waferKUSHIBE MITSUHIRO·Filed 2012·Granted Jan 20, 2015·6 cites·18 claims
- 2086US8685872B2Low softening point glass composition, bonding material using same and electronic partsHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 1, 2014·3 cites·6 claims
- 2186US6638352B2Thermal stable low elastic modulus material and device using the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·31 cites·6 claims
- 2285US11603063B2Occupant protection deviceTOYODA GOSEI KK·Filed 2021·Granted Mar 14, 2023·2 cites·3 claims
- 2384US6642736B2Tester for semiconductor integrated circuits and method for testing semiconductor integrated circuitsMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 4, 2003·30 cites·18 claims
- 2483US8421085B2Semiconductor light-emitting deviceKATSUNO HIROSHI·Filed 2010·Granted Apr 16, 2013·7 cites·19 claims
- 2583US6690189B2Apparatus and method for testing semiconductor integrated circuitRENESAS TECH CORP·Filed 2001·Granted Feb 10, 2004·32 cites·8 claims
- 2683US5791309ABalancer shaft supporting structure in engineHONDA MOTOR CO LTD·Filed 1997·Granted Aug 11, 1998·45 cites·8 claims
- 2782US8708392B2Retractable vehicle seatOTSUKA TAIYOU·Filed 2011·Granted Apr 29, 2014·15 cites·3 claims
- 2882US8487222B2Heating electrode and method for heating material-to-be-heated by using the heating electrodeYAMADA SHINJI·Filed 2008·Granted Jul 16, 2013·5 cites·12 claims
- 2982US7224228B2Semiconductor integrated circuit for high frequency power amplifier, electronic component for high frequency power amplifier, and radio communication systemRENESAS TECH CORP·Filed 2006·Granted May 29, 2007·8 cites·6 claims
- 3081US4509203AAuto tuning receiver with a tuning information memorySHARP KK·Filed 1982·Granted Apr 2, 1985·32 cites·13 claims
- 3180US8466435B2Fine particle measuring deviceTOISHI MITSURU·Filed 2011·Granted Jun 18, 2013·4 cites·5 claims
- 3279US8384045B2Minute particle analyzing device and methodSONY CORP·Filed 2010·Granted Feb 26, 2013·3 cites·7 claims
- 3379US6620067B1Tensioner deviceHONDA MOTOR CO LTD·Filed 2000·Granted Sep 16, 2003·18 cites·14 claims
- 3478US8569738B2Semiconductor light emitting device, wafer, method for manufacturing semiconductor light emitting device, and method for manufacturing waferKUSHIBE MITSUHIRO·Filed 2010·Granted Oct 29, 2013·3 cites·29 claims
- 3578US6714888B2Apparatus for testing semiconductor integrated circuitRENESAS TECH CORP·Filed 2001·Granted Mar 30, 2004·23 cites·7 claims
- 3678US2025381929A1Passenger protection deviceTOYODA GOSEI KK·Filed 2025·Application pending·0 cites
- 3776US8307863B2Fuel filling and waste solution recovery apparatus and fuel vesselNOUJIMA MASAFUMI·Filed 2008·Granted Nov 13, 2012·6 cites·19 claims
- 3875US5741577AMagnetic recording medium having a lubricant layer with a specified structure of a specified perfluoropolyether lubricantKAO CORP·Filed 1995·Granted Apr 21, 1998·29 cites·5 claims
- 3974US8890194B2Semiconductor light emitting deviceGOTODA TORU·Filed 2012·Granted Nov 18, 2014·2 cites·20 claims
- 4073US9012888B2Semiconductor light emitting device, wafer, method for manufacturing semiconductor light emitting device, and method for manufacturing waferKUSHIBE MITSUHIRO·Filed 2012·Granted Apr 21, 2015·2 cites·14 claims
- 4173US6634004B1Threshold analysis system capable of deciding all threshold voltages included in memory device through single processingMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 14, 2003·20 cites·16 claims
- 4272US8820989B2Fixing structure of indoor lampSUZUKI HIROYUKI·Filed 2012·Granted Sep 2, 2014·3 cites·3 claims
- 4371US6456102B1External test ancillary device to be used for testing semiconductor device, and method of testing semiconductor device using the deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 24, 2002·15 cites·11 claims
- 4470US9269868B2Semiconductor light emitting element and method for manufacturing semiconductor light emitting elementTOSHIBA KK·Filed 2014·Granted Feb 23, 2016·1 cites·32 claims
- 4570US7167378B2Circuit board transmitting high frequency signalSHARP KK·Filed 2004·Granted Jan 23, 2007·13 cites·8 claims
- 4670US6661248B2Tester for semiconductor integrated circuitsMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 9, 2003·14 cites·17 claims
- 4770US2025089923A1Microwave irradiation device, microwave irradiation method, and method for manufacturing foodTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2024·Application pending·0 cites
- 4869US7717081B2Engine cylinder head structureSUZUKI MOTOR CORP·Filed 2007·Granted May 18, 2010·5 cites·3 claims
- 4969US6756441B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2001·Granted Jun 29, 2004·9 cites·9 claims
- 5069US6002166ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 14, 1999·39 cites·8 claims
Showing the top 50 of 143 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →