Inventor · disambiguated record
Shin-Ichi Yamagata
Also filed as: YAMAGATA SHIN-ICHI
9 granted patents·1 pending application·160 citations·filing 1994–2021
89Inventor score
Top patents by PatentIndex Score
10 records- 0177US7180178B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Feb 20, 2007·7 cites·25 claims
- 0274US6507105B1Member for semiconductor device and method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted Jan 14, 2003·20 cites·6 claims
- 0373US6280496B1Silicon carbide based composite material and manufacturing method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Aug 28, 2001·42 cites·30 claims
- 0473US5828127ASemiconductor substate with improved thermal conductivitySUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Oct 27, 1998·46 cites·60 claims
- 0561US6123895AAluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Sep 26, 2000·24 cites·23 claims
- 0656US12451407B2Composite material, semiconductor package, and method of manufacturing composite materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 0755US5533930AApparatus for producing a silicon nitride sintered bodySUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jul 9, 1996·17 cites·9 claims
- 0844US6979901B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Dec 27, 2005·1 cites·20 claims
- 0940US2008298024A1Heat spreader and method for manufacturing the same, and semiconductor deviceALMT CORP·Filed 2008·Application pending·0 cites
- 1031US5605558ANitrogenous aluminum-silicon powder metallurgical alloySUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Feb 25, 1997·3 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →