Inventor · disambiguated record
Shintaro Yamamichi
Also filed as: YAMAMICHI SHINTARO
66 granted patents·25 pending applications·1,079 citations·filing 1992–2024
99Inventor score
Top patents by PatentIndex Score
91 records- 0196US8004074B2Semiconductor device and fabrication methodNEC CORP·Filed 2008·Granted Aug 23, 2011·53 cites·14 claims
- 0295US8569892B2Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2009·Granted Oct 29, 2013·41 cites·9 claims
- 0395US6225133B1Method of manufacturing thin film capacitorNEC CORP·Filed 1994·Granted May 1, 2001·138 cites·8 claims
- 0494US6524905B2Semiconductor device, and thin film capacitorNEC CORP·Filed 2001·Granted Feb 25, 2003·76 cites·7 claims
- 0592US8039756B2Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Oct 18, 2011·20 cites·15 claims
- 0692US6818469B2Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the sameNEC CORP·Filed 2003·Granted Nov 16, 2004·71 cites·35 claims
- 0790US8072073B2Semiconductor device and method of manufacturing sameKIKUCHI KATSUMI·Filed 2008·Granted Dec 6, 2011·23 cites·19 claims
- 0890US7791186B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Sep 7, 2010·17 cites·32 claims
- 0990US6515324B2Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing sameNEC CORP·Filed 2001·Granted Feb 4, 2003·59 cites·22 claims
- 1090US5366920AMethod for fabricating a thin film capacitorNEC CORP·Filed 1994·Granted Nov 22, 1994·94 cites·11 claims
- 1189US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 1288US8710639B2Semiconductor element-embedded wiring substrateKIKUCHI KATSUMI·Filed 2011·Granted Apr 29, 2014·11 cites·21 claims
- 1388US5262920AThin film capacitorNEC CORP·Filed 1992·Granted Nov 16, 1993·75 cites·12 claims
- 1487US8692135B2Wiring board capable of containing functional element and method for manufacturing sameFUNAYA TAKUO·Filed 2009·Granted Apr 8, 2014·25 cites·2 claims
- 1587US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 1686US9324663B2Semiconductor device including a plurality of magnetic shieldsRENESAS ELECTRONICS CORP·Filed 2014·Granted Apr 26, 2016·8 cites·24 claims
- 1786US7745736B2Interconnecting substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jun 29, 2010·15 cites·28 claims
- 1885US8766440B2Wiring board with built-in semiconductor elementKIKUCHI KATSUMI·Filed 2011·Granted Jul 1, 2014·9 cites·29 claims
- 1985US8035217B2Semiconductor device and method for manufacturing sameNEC CORP·Filed 2008·Granted Oct 11, 2011·9 cites·20 claims
- 2084US8304915B2Semiconductor device and method for manufacturing the sameMORI KENTARO·Filed 2009·Granted Nov 6, 2012·12 cites·23 claims
- 2184US7880295B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2009·Granted Feb 1, 2011·9 cites·6 claims
- 2284US7348673B2Semiconductor deviceNEC CORP·Filed 2005·Granted Mar 25, 2008·13 cites·34 claims
- 2384US6703705B2Semiconductor device and method for packaging sameNEC CORP·Filed 2001·Granted Mar 9, 2004·31 cites·19 claims
- 2483US7649749B2Wiring substrate, semiconductor device, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·10 cites·26 claims
- 2580US9117814B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Aug 25, 2015·4 cites·13 claims
- 2680US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 2776US10098179B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 9, 2018·4 cites·23 claims
- 2876US2025062275A1Injection molded solder head with improved sealing performanceIBM·Filed 2024·Application pending·0 cites
- 2974US8749033B2Semiconductor device and method of manufacturing semiconductor deviceWATANABE TAKAHITO·Filed 2011·Granted Jun 10, 2014·5 cites·19 claims
- 3074US7999401B2Semiconductor device and method of manufacturing sameNEC CORP·Filed 2008·Granted Aug 16, 2011·6 cites·20 claims
- 3172US9172028B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 27, 2015·3 cites·18 claims
- 3272US8929090B2Functional element built-in substrate and wiring substrateNAKASHIMA YOSHIKI·Filed 2011·Granted Jan 6, 2015·4 cites·19 claims
- 3372US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 3470US8815678B2Method for fabricating a metal-insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD)IIZUKA TOSHIHIRO·Filed 2007·Granted Aug 26, 2014·2 cites·18 claims
- 3570US8810008B2Semiconductor element-embedded substrate, and method of manufacturing the substrateMORI KENTARO·Filed 2011·Granted Aug 19, 2014·3 cites·29 claims
- 3670US8004085B2Semiconductor device and method of manufacturing semiconductor deviceNEC CORP·Filed 2008·Granted Aug 23, 2011·4 cites·10 claims
- 3769US8169013B2Metal-insulator-metal (MIM) capacitor having capacitor dielectric material selected from a group consisting of ZRO2, HFO2, (ZRX, HF1-X)O2 (0<x<1), (ZRy, Ti (O<y<1), (Hfz, Ti-z)O2 (O<z<1) and (Zrk, Ti1, Hfm)O2 (O<K, 1, m<1, K+1+m=1)IIZUKA TOSHIHIRO·Filed 2006·Granted May 1, 2012·2 cites·10 claims
- 3869US8050050B2Wiring board, semiconductor device, and method of manufacturing the sameNEC CORP·Filed 2010·Granted Nov 1, 2011·2 cites·12 claims
- 3968US12166008B2Injection molded solder head with improved sealing performanceIBM·Filed 2021·Granted Dec 10, 2024·0 cites·18 claims
- 4068US5539613ACompact semiconductor device including a thin film capacitor of high reliabilityNEC CORP·Filed 1993·Granted Jul 23, 1996·27 cites·13 claims
- 4167US8552570B2Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor deviceKIKUCHI KATSUMI·Filed 2009·Granted Oct 8, 2013·3 cites·13 claims
- 4267US8536691B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2007·Granted Sep 17, 2013·4 cites·25 claims
- 4367US5943547AMethod of forming highly-integrated thin film capacitor with high dielectric constant layerNEC CORP·Filed 1997·Granted Aug 24, 1999·26 cites·8 claims
- 4466US8692364B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2010·Granted Apr 8, 2014·2 cites·20 claims
- 4565US5883781AHighly-integrated thin film capacitor with high dielectric constant layerNEC CORP·Filed 1996·Granted Mar 16, 1999·24 cites·4 claims
- 4665US5847423ASemiconductor device having a thin film capacitor and a resistance measuring elementNEC CORP·Filed 1997·Granted Dec 8, 1998·30 cites·19 claims
- 4764US9362262B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·1 cites·14 claims
- 4864US6292352B1Thin film capacitorNEC CORP·Filed 2000·Granted Sep 18, 2001·11 cites·20 claims
- 4963US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 5059US7889514B2Wiring board, semiconductor device, and method of manufacturing the sameNEC CORP·Filed 2006·Granted Feb 15, 2011·1 cites·12 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →