Inventor · disambiguated record
Shigeru Yamane
Also filed as: YAMANE SHIGERU
16 granted patents·1 pending application·143 citations·filing 1994–2024
93Inventor score
Top patents by PatentIndex Score
17 records- 0185US6518515B2Printed wiring board, and method and apparatus for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 11, 2003·30 cites·5 claims
- 0269US5490227ALight receiving module for SCM transmissionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Feb 6, 1996·33 cites·23 claims
- 0368US6523258B2Method of manufacturing printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 25, 2003·13 cites·20 claims
- 0467US12472816B2Touch input device and method of manufacturing operation panelPANASONIC IP MAN CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·16 claims
- 0567US6528733B2Multi-layer circuit board and method of manufacturing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 4, 2003·12 cites·29 claims
- 0666US10962702B2Input devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·14 claims
- 0761US6838164B2Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 4, 2005·6 cites·3 claims
- 0858US6365844B2Printed wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 2, 2002·20 cites·7 claims
- 0956US6890449B2Method for manufacturing printed-circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 10, 2005·6 cites·12 claims
- 1054US6700071B2Multi-layer circuit board having at least two or more circuit patterns connectedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 2, 2004·4 cites·15 claims
- 1151US6993836B2Circuit board and method of manufacturing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 7, 2006·3 cites·22 claims
- 1251US6814836B2Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 9, 2004·2 cites·6 claims
- 1350US6671951B2Printed wiring board, and method and apparatus for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 6, 2004·3 cites·61 claims
- 1449US7754321B2Method of manufacturing clad board for forming circuitry, clad board and core board for clad boardPANASONIC CORP·Filed 2003·Granted Jul 13, 2010·2 cites·18 claims
- 1548US6833042B2Method of manufacturing clad board for forming circuitry, clad board, and core board for clad boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 21, 2004·2 cites·12 claims
- 1640US6409869B1Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 25, 2002·6 cites·20 claims
- 1733US2004020046A1Production method for conductive paste and production method for printed circuitFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shigeru Yamane files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →