Inventor · disambiguated record
Shigeru Yamatsu
Also filed as: YAMATSU SHIGERU
10 granted patents·6 pending applications·12 citations·filing 2004–2021
81Inventor score
Top patents by PatentIndex Score
16 records- 0187US10703939B2Acrylic composition for sealing, sheet material, multilayer sheet, cured product, semiconductor device and method for manufacturing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 7, 2020·6 cites·15 claims
- 0266US10870756B2Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted Dec 22, 2020·1 cites·25 claims
- 0362US10797013B2Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Oct 6, 2020·1 cites·12 claims
- 0455US7166334B2Method of manufacturing disc-shaped recording mediumTDK CORP·Filed 2004·Granted Jan 23, 2007·2 cites·5 claims
- 0554US7385911B2Optical recording medium having multiple layers of different thermal conductivitiesTDK CORP·Filed 2004·Granted Jun 10, 2008·2 cites·4 claims
- 0653US2020306893A1Solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 0751US12275839B2Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structurePANASONIC IP MAN CO LTD·Filed 2019·Granted Apr 15, 2025·0 cites·8 claims
- 0848US12269945B2Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structurePANASONIC IP MAN CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·19 claims
- 0946US11674032B2Encapsulation resin composition, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 13, 2023·0 cites·8 claims
- 1045US11195769B2Thermosetting composition for use as underfill material, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·7 claims
- 1144US12240061B2Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structurePANASONIC IP MAN CO LTD·Filed 2021·Granted Mar 4, 2025·0 cites·16 claims
- 1244US2022115285A1Encapsulation material, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor devicePANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1343US2005207329A1Optical recording mediumTDK CORP·Filed 2004·Application pending·0 cites
- 1442US2006099459A1Information recording mediumTDK CORP·Filed 2004·Application pending·0 cites
- 1542US2005072518A1Method of manufacturing disc-shaped recording mediumTDK CORP·Filed 2004·Application pending·0 cites
- 1642US2005084644A1Optical recording medium and method for fabricating the sameTDK CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →