Inventor · disambiguated record
Sheng-Fan Yang
Also filed as: YANG SHENG · YANG SHENG-FAN
21 granted patents·13 pending applications·13 citations·filing 2010–2024
89Inventor score
Top patents by PatentIndex Score
34 records- 0187US11869846B1Interposer routing structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
- 0287US10791618B2Neutron beam source generator and filterIND TECH RES INST·Filed 2017·Granted Sep 29, 2020·7 cites·8 claims
- 0384US11109476B2FilterHERON NEUTRON MEDICAL CORP·Filed 2020·Granted Aug 31, 2021·2 cites·3 claims
- 0467US10736209B2Circuit board structure and conductive transmission line structure thereofGLOBAL UNICHIP CORP·Filed 2019·Granted Aug 4, 2020·1 cites·10 claims
- 0559US11205840B2RF energy transmitting apparatus with positioning and polarization tracing function, RF energy harvesting apparatus and RF energy transmitting methodDELTA ELECTRONICS INC·Filed 2020·Granted Dec 21, 2021·0 cites·5 claims
- 0658US2025273583A1Interposer device and semiconductor package deviceGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0757US2025105163A1Semiconductor chiplet device and interposerGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0856US12446145B2Circuit board device and its circuit moduleGLOBAL UNICHIP CORP·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 0956US11374434B2Radio frequency energy-harvesting apparatusDELTA ELECTRONICS INC·Filed 2019·Granted Jun 28, 2022·0 cites·5 claims
- 1056US2025349695A1Substrate structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 1156US2025385191A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 1256US2025355036A1Method, apparatus and system for monitoring ultra-high frequency partial discharge of hydro-generatorCHINA ENERGY SCIENCE AND TECH RESEARCH INSTITUTE CO LTD·Filed 2024·Application pending·0 cites
- 1355US2025226330A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 1454US2025380355A1Wiring substrateGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 1553US12066968B2Communication interface structure and Die-to-Die packageGLOBAL UNICHIP CORP·Filed 2022·Granted Aug 20, 2024·0 cites·18 claims
- 1653US11869845B2Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 1751US12230578B2Semiconductor chiplet deviceGLOBAL UNICHIP CORP·Filed 2022·Granted Feb 18, 2025·0 cites·13 claims
- 1850US12406955B2Power distribution device, power distribution system and manufacturing method thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Sep 2, 2025·0 cites·9 claims
- 1950US10644393B2RF energy transmitting apparatus, RF energy harvesting apparatus and method of RF energy transmittingDELTA ELECTRONICS INC·Filed 2017·Granted May 5, 2020·0 cites·19 claims
- 2049US12506057B2Interposer device and semiconductor package structureGLOBAL UNICHIP CORP·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 2148US8196078B2Method for predicting and debugging EMI characteristics in IC system and related machine-readable mediumCHEN TUNG-YANG·Filed 2010·Granted Jun 5, 2012·1 cites·22 claims
- 2247US8332804B2Impedance design methodHSU HSING-CHOU·Filed 2012·Granted Dec 11, 2012·0 cites·3 claims
- 2347US2017108585A1Radio frequency energy-transmitting apparatus with location detection function and radio frequency energy-harvesting apparatus and radio frequency energy-transmitting method with location detection functionDELTA ELECTRONICS INC·Filed 2015·Application pending·0 cites
- 2446US11309936B2Signal transmission deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Apr 19, 2022·0 cites·10 claims
- 2545US10892238B2Circuit structure and chip packageGLOBAL UNICHIP CORP·Filed 2019·Granted Jan 12, 2021·0 cites·18 claims
- 2644US8151241B2Impedance design methodHSU HSING-CHOU·Filed 2010·Granted Apr 3, 2012·0 cites·4 claims
- 2743US11335631B2Power delivery device and methodGLOBAL UNICHIP CORP·Filed 2020·Granted May 17, 2022·0 cites·9 claims
- 2839US2013265247A1Touch panelHIMAX TECH LTD·Filed 2013·Application pending·0 cites
- 2938US10790223B2Integrated circuit package element and load board thereofGLOBAL UNICHIP CORP·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
- 3038US2014306920A1Touch screen structure for receiving and processing touch signalHIMAX TECH LTD·Filed 2013·Application pending·0 cites
- 3137US2013234979A1Touch cell applied to capacitive touch panel and associated capacitive touch panelHIMAX TECH LTD·Filed 2012·Application pending·0 cites
- 3232US10038571B2Method for reading and writing forwarding information base, and network processorHUAWEI TECH CO LTD·Filed 2016·Granted Jul 31, 2018·0 cites·10 claims
- 3332US2012176150A1Measuring equipment for probe-effect cancellation and method thereofHSU HSING-CHOU·Filed 2011·Application pending·0 cites
- 3425US2013050884A1Electrostatic discharge (esd) protection element and esd circuit thereofTSAI CHING-LING·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →